Light-Emitting Semiconductor Structure With Flat Display Region
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Solution Overview
Problem
The challenge in semiconductor manufacturing is the integration of display and bonding pad regions on a substrate, where the surface of the display region is not flat enough for forming light emitting elements due to dishing phenomena and the thickness of circuit layers leads to insufficient material gap filling and accuracy issues.
Innovation Solution
The integration of a substrate with a display region and bonding pad region is achieved by forming contact plugs and bonding pads in an array within the dielectric layer, ensuring a flat surface and precise circuit layers, with thinner bonding pads to prevent dishing and improve material filling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the display region and bonding pad region are formed separately on different substrates, then the manufacturing process is simpler, but the element space is wasted and integration is reduced
Solution Approach 1:
The patent merges the display region and bonding pad region onto the same substrate, eliminating the need for separate substrates and reducing element space waste. The method forms circuit layers, contact plugs, and bonding pads in an integrated manufacturing process that handles both regions simultaneously, achieving high integration while maintaining manufacturability through standardized semiconductor fabrication techniques.
Solution Approach 2:
The substrate is designed to serve multiple functions: it acts as both the display region substrate and the bonding pad region substrate. The circuit layer and dielectric layer structures are configured to provide both display functionality and bonding pad functionality within the same structural framework, enabling one substrate to fulfill multiple roles that previously required separate substrates.
2Reliability
If thick circuit layers are used to ensure complete coverage, then connectivity is improved, but material gap filling becomes insufficient and manufacturing precision decreases
Solution Approach 1:
The patent applies different thickness specifications for circuit layers in different regions: the first circuit layer in the display region has a first thickness, while the second circuit layer in the bonding pad region has a second thickness that is greater than the first thickness. This local differentiation ensures adequate coverage and connectivity in the bonding pad region where thicker layers are needed, while maintaining manufacturing precision in the display region where thinner layers suffice.
Solution Approach 2:
The patent changes the thickness parameter of the circuit layers based on regional requirements. By adjusting the circuit layer thickness locally across different regions of the substrate, the invention optimizes both connectivity reliability and manufacturing precision for each specific functional area.
3Reliability
If bonding pads are made thicker to ensure adequate coverage, then connectivity is improved, but dishing phenomena occur and surface flatness deteriorates
Solution Approach 1:
The patent segments the substrate into distinct functional regions: a display region with a first surface and a bonding pad region with a second surface. This segmentation allows the bonding pads to be concentrated in the bonding pad region, ensuring adequate coverage and connectivity without causing dishing phenomena to affect the display region's surface flatness. The display region maintains its flat surface for optimal display performance.
Data Source
AI summary
The invention provides a semiconductor structure including light emitting elements, the semiconductor structure includes a substrate, a display region and a contact pad region are defined on the substrate, a circuit layer is formed on the substrate, and the circuit layer is located in the display region and the contact pad region, a plurality of contact plugs are located in the display region and the contact pad region and electrically connected with the circuit layer, the plurality of contact plugs in the display region are arranged in an array, and a plurality of light emitting elements are located in the display region and electrically connected with the contact plugs.