Semiconductor Flipping Fixture With Simultaneous Surface Pressing
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Solution Overview
Problem
Existing semiconductor manufacturing apparatuses are unable to reliably flip bonded semiconductor devices immediately after the bonding process, as the bonding strength is still weak, leading to a risk of device separation and reduced fabrication efficiency.
Innovation Solution
An apparatus with a fixture system that simultaneously presses and rotates both surfaces of the semiconductor device to flip it, using an extension/retraction mechanism and vacuum paths to securely hold the device during the flipping process, thereby reducing the risk of separation and increasing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional flipping apparatus is used to flip bonded semiconductor devices, then the device can be reoriented for subsequent processing, but the weak bonding strength causes device separation and reduces reliability
Solution Approach 1:
The patent applies preliminary action by pressing the semiconductor device against the anvil surface before rotation occurs. The pressing mechanism ensures the device is firmly attached to the anvil prior to the flipping operation, preventing separation during the rotation process. This pre-securing action resolves the contradiction by preparing the device in advance to withstand the subsequent flipping operation.
Solution Approach 2:
The patent implements beforehand cushioning by providing a cushioning layer between the pressing mechanism and the semiconductor device. This cushioning layer protects the device from damage during the pressing and rotation operations while ensuring firm attachment. The cushioning acts as a buffer that secures the device beforehand, preventing separation during flipping while protecting the weak bonding interface.
2Productivity
If bonding is performed to form 3D semiconductor structures, then device density and performance are improved, but the bonding strength remains weak immediately after bonding, causing separation risk
Solution Approach 1:
The patent applies preliminary action by securing the device to the anvil through pressing before any rotation or handling occurs. This pre-securing mechanism ensures that even though the bonding strength is weak immediately after bonding, the device cannot separate during subsequent operations. The preliminary attachment to the anvil compensates for the weak inter-device bonding.
Solution Approach 2:
The patent introduces an intermediary mechanism - the anvil with pressing capability - that mediates between the weakly bonded device and the handling process. The anvil acts as a temporary support that holds the device securely during critical operations, allowing the weak bonding to be maintained without separation. This intermediary structure enables handling of high-density 3D devices despite weak bonding.
3Reliability
If the semiconductor device is held by pressing during rotation, then separation is prevented, but the mechanism complexity increases
Solution Approach 1:
The patent applies universality by designing the anvil to serve multiple functions: it provides a pressing surface for securing the device, acts as a rotation axis, and serves as a support structure during flipping. This multi-functional design prevents device separation during rotation without requiring separate complex fixturing mechanisms, thereby reducing overall system complexity while maintaining reliability.
Solution Approach 2:
The patent implements self-service by designing the anvil and pressing mechanism to automatically secure and rotate the device in a single integrated operation. The mechanism presses the device against the anvil and rotates it as one coordinated action, eliminating the need for separate complex clamping and rotation systems. This self-contained approach prevents separation while minimizing mechanism complexity.
Data Source
AI summary
Embodiments of apparatus for flipping a semiconductor device and method of using the same are disclosed. In an example, an apparatus for flipping a semiconductor device includes at least one fixture and a rotation unit connected to the at least one fixture. The at least one fixture is configured to hold the semiconductor device by simultaneously pressing a first surface and a second surface of the semiconductor device. The first surface is opposite to the second surface. The rotation unit is configured to rotate the at least one fixture to flip the semiconductor device held by the at least one fixture.