Semiconductor Flipping Apparatus Using Thermal Adhesive

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Solution Overview

Problem

The existing manual flipping process of semiconductor devices is time-consuming, prone to human error, and risks damaging the devices, especially when handling semiconductor devices in wafer or chip form.

Innovation Solution

An apparatus comprising a platform, a positioning unit with a circular opening, an elevating unit, and a roller system with a movable heater is used to automate the flipping process, employing an adhesive substance with temperature-dependent stickiness to securely transfer and reverse the top and bottom surfaces of semiconductor devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If manual flipping is used, then flexibility and simplicity are maintained, but productivity is low and device damage risk increases

Engineering Contradiction:

Improveflipping speedVSAvoidapparatus complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The flipping apparatus is divided into distinct functional modules: a positioning unit with opening for device placement, an elevating unit for vertical movement, and a heater for thermal processing. This segmentation allows each component to perform its specific function efficiently while maintaining overall system manageability and productivity improvement.

Inventive Principle:

Principle #1Segmentation

2Reliability

If manual flipping is used, then device handling is simple, but reliability decreases due to human error and damage risk

Engineering Contradiction:

Improvedevice safetyVSAvoidapparatus structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The positioning unit with its opening acts as an intermediary structure that securely holds the semiconductor device during the flipping process. This mediator component eliminates direct human handling, preventing damage while maintaining controlled and reliable operation through the automated apparatus.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The manual mechanical flipping action is replaced with an automated system combining elevating units for precise positioning and heaters for thermal processing. This substitution eliminates human error and damage risk while maintaining controlled operation through automated mechanical and thermal mechanisms.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If automated flipping apparatus is introduced, then productivity increases, but manufacturing cost increases

Engineering Contradiction:

Improveflipping throughputVSAvoidmanufacturing cost

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The flipping apparatus is designed with multi-functional components that can handle various semiconductor devices and integrate with existing manufacturing processes. The positioning unit, elevating unit, and heater serve multiple purposes in the device processing workflow, improving productivity while reducing the need for additional specialized equipment and lowering overall manufacturing costs.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus efficiently automates the flipping process, reducing human intervention and damage risks, while ensuring precise and reliable surface reversal of semiconductor devices, such as light-emitting diode wafers or chips, by using a combination of mechanical and thermal mechanisms.

Implementation Method 1

employing an adhesive substance with temperature-dependent stickiness to securely transfer and reverse the top and bottom surfaces of semiconductor devices

Methodology Applied

Scientific EffectTemperature-dependent stickiness: Thermal Expansion

Data Source

PatentUS10651069B2Apparatus for flipping semiconductor device

Publication Date: 2020.05.12 ENNOSTAR CORP

AI summary

An apparatus for transferring a semiconductor device comprises platform comprising a carrier; a positioning unit above the platform and comprising an opening; and an elevating unit connecting the platform and the positioning unit; and a heater.