Semiconductor Floating Fin Structure with Air-Gap Stress Buffer

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Solution Overview

Problem

MEMS devices with floating structures are prone to damage during motion due to mechanical stress, which affects their stability and lifetime.

Innovation Solution

Incorporation of a buffering structure comprising a soft material layer and an air gap within the conductive layers to absorb stress and prevent damage to the floating members.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a floating structure is used in MEMS devices, then the device can achieve required mechanical functionality, but the floating structure is prone to damage during motion due to mechanical stress

Engineering Contradiction:

Improvemechanical functionalityVSAvoidstability and lifetime

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

A buffering structure comprising a soft material layer and an air gap is formed between the floating member and the substrate before the floating member is released. This buffering structure acts as a cushion to absorb mechanical stress during motion, preventing damage to the floating structure and improving device reliability while maintaining mechanical functionality

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Ease of operation

If the floating member is released from the substrate, then mechanical motion is enabled, but the floating member becomes vulnerable to mechanical stress damage

Engineering Contradiction:

Improvemechanical motionVSAvoidresistance to mechanical stress

Core Design Contradiction:

Ease of operationVSStrength

Solution Approach 1:

The buffering structure serves as an intermediary element between the floating member and the substrate. It provides mechanical support and stress absorption while allowing the floating member to move freely, thus enabling mechanical motion while protecting against stress damage

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of manufacture

If conventional manufacturing processes are used, then production is straightforward, but the floating structures are easily damaged during motion

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidoperational reliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The buffering structure is formed using conventional semiconductor manufacturing processes before the floating member is released. This preliminary formation of the buffering structure ensures that the floating member is protected from the start, improving operational reliability without adding significant manufacturing complexity

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The buffering structure enhances the stability and extends the lifetime of MEMS devices by absorbing mechanical stress, thereby improving their operational reliability.

Implementation Method 1

an air gap formed in the first conductive layer

Methodology Applied

Scientific EffectCompression: Compression

Implementation Method 2

a buffering structure disposed in the first conductive layer... absorb stress and prevent damage

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS12448279B2Semiconductor structure and method of manufacturing the same

Publication Date: 2025.10.21 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor structure is provided. The semiconductor structure includes a substrate, a pillar structure, a fin structure, and a buffering structure. The pillar structure is disposed on the substrate. The fin structure is connected to the pillar structure and is separate from the substrate. The buffering structure is disposed in the fin structure and includes a soft material layer and an air gap surrounded by the soft material layer. A method of manufacturing the semiconductor structure is also provided.