Semiconductor Fluid Filtration Using Chelation for Metal Ion Defects
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Solution Overview
Problem
Semiconductor wafers face defects such as metal cones due to high levels of metal ions in the fluids used in semiconductor fabrication processes.
Innovation Solution
A fluid filtration system is employed that includes a metal ion filter to reduce metal ions in the fluids, specifically using a type 1 filter that filters metal ions via chemical chelation or ion exchange, thereby producing a filtered fluid with reduced metal ions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If fluid filtration is performed using conventional filters, then fluid flow is maintained, but metal ion contamination remains high causing wafer defects
Solution Approach 1:
The patent changes the chemical parameters of the filtration system by introducing chelating agents that alter the fluid's chemical properties to bind and remove metal ions. This chemical parameter change enables the filtration system to specifically target and remove metal ion contaminants while maintaining fluid flow, directly resolving the contradiction between manufacturing precision and metal ion contamination.
Solution Approach 2:
The filtration system employs composite filtering media that combines physical filtration materials with chemical chelating agents. This composite approach allows the system to simultaneously perform physical filtration and chemical binding of metal ions, achieving both fluid flow maintenance and metal ion removal, thus resolving the technical contradiction.
2Manufacturing precision
If metal ion filtration is intensified to reduce contamination, then wafer quality improves, but system complexity increases
Solution Approach 1:
The patent merges multiple filtration functions into a single integrated filter assembly that combines physical filtration and chemical chelation in one unit. This consolidation achieves intensive metal ion removal while avoiding the need for multiple separate filtration systems, thus improving wafer quality without proportionally increasing system complexity.
Solution Approach 2:
The chelating agents serve as intermediary substances that facilitate metal ion removal without requiring complex mechanical or chemical processing systems. These intermediaries bind metal ions in the fluid, enabling effective contamination control through a relatively simple filtration approach, resolving the contradiction between manufacturing precision and device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of the fluid filtration system results in a significant reduction of wafer defects, including a 52% reduction in metal cones, by minimizing metal ion contamination in the semiconductor fabrication process.
Implementation Method 1
a type 1 filter that filters metal ions via chemical chelation
Implementation Method 2
a type 1 filter that filters metal ions via chemical chelation or ion exchange
Data Source
AI summary
A fluid filtration system for a semiconductor processing station is provided. The fluid filtration system includes a first filter configured to filter metal ions from a first fluid to produce a first filtered fluid. The fluid filtration system includes a second filter configured to filter particles from the first filtered fluid to produce a second filtered fluid. The fluid filtration system includes a conduit configured to conduct the second filtered fluid to the semiconductor processing station.