Semiconductor Frame Structure for Adhesive Overflow Control
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Solution Overview
Problem
The challenge of controlling adhesive overflow in semiconductor devices leads to non-uniform contact between the semiconductor element and the thermal compensation plate, resulting in deteriorated adhesion and increased contact resistance.
Innovation Solution
A frame structure with a first surface and second surfaces having different slopes is used to guide and contain adhesive, preventing it from contacting the thermal compensation plate, thereby maintaining uniform contact and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If adhesive is provided between the frame and semiconductor element for alignment, then alignment precision is improved, but adhesive overflow occurs and contacts the thermal compensation plate causing adhesion deterioration
Solution Approach 1:
A resin layer is introduced as an intermediary substance between the adhesive and the thermal compensation plate. This resin layer prevents direct contact between the adhesive and the thermal compensation plate, thereby eliminating the harmful effect of adhesive contamination while preserving the alignment function of the adhesive between the frame and semiconductor element.
Solution Approach 2:
The patent applies a counter-action by providing the resin layer in advance to prevent the harmful effect of adhesive overflow. The resin layer is positioned beforehand to block any potential contact between overflowed adhesive and the thermal compensation plate, thus preventing adhesion deterioration before it occurs.
2Reliability
If adhesive overflows and contacts the thermal compensation plate, then adhesion between semiconductor element and thermal compensation plate deteriorates, but this leads to non-uniform contact state and increased contact resistance
Solution Approach 1:
The resin layer serves as a protective intermediary that prevents adhesive contamination of the thermal compensation plate. This ensures uniform contact between the thermal compensation plate and the semiconductor element by eliminating localized adhesion deterioration caused by adhesive overflow, thereby maintaining consistent contact resistance across the entire contact surface.
3Manufacturing precision
If frame is arranged around semiconductor element for alignment, then alignment is improved, but adhesive overflow control becomes difficult
Solution Approach 1:
The resin layer is applied to the thermal compensation plate before assembly, creating a protective barrier that simplifies the manufacturing process. This intermediary layer eliminates the need for precise adhesive application control, as any overflow is contained by the resin layer and prevented from reaching the thermal compensation plate, thereby improving ease of manufacture while maintaining alignment accuracy.
Data Source
AI summary
According to the present embodiment, a semiconductor device includes a semiconductor element and a frame. The semiconductor element has a first electrode surface and a second electrode surface opposed to the first electrode surface. The frame is arranged around the semiconductor element and has an opening facing the first electrode surface. The frame includes a first structure and a second structure. The first structure extends from an end of the semiconductor element to inside of the first electrode surface and has a first surface facing the first electrode surface. The second structure extends further to inside of the first electrode surface from the first structure and has a second surface that faces the first electrode surface and is different from the first surface.