Semiconductor Package Frame Layout for Higher Device Density
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Solution Overview
Problem
Existing semiconductor device manufacturing methods result in low density of discrete devices on metal frames due to large unused areas and limitations in design and cutting methods, which restrict the use of pins in specific applications.
Innovation Solution
A semiconductor device assembly with optimized metal frame and unit layout, integrated encapsulation, and cutting techniques to increase density and facilitate pin bending, combined with a method that includes mounting chips, connectors, and encapsulation followed by cutting and shaping to form single products.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional plastic packaging is used for single power semiconductor discrete devices, then each device can be individually positioned and isolated, but the metal frame has large useless area and low device density
Solution Approach 1:
Multiple semiconductor devices are integrated into a single modular unit with shared encapsulation layer and common flow channels, eliminating the need for individual isolation structures while maintaining device functionality and reliability
Solution Approach 2:
The metal frame is designed with universal block-format structures that can accommodate multiple devices in standardized configurations, allowing the same frame design to serve multiple devices without customization for each individual device
2Quantity of substance
If modular integration with block format design is adopted, then device density on metal frame is increased, but appearance of devices is limited and pin flexibility is restricted
Solution Approach 1:
The modular unit is segmented into distinct components including the encapsulation layer, metal frame, and pin structures, allowing the pin configuration to be independently adjusted or bent after integration without affecting the overall modular structure
Solution Approach 2:
The pin structures are designed with dynamic flexibility, allowing them to be bent or repositioned after the modular integration process to meet specific application requirements, transforming the static modular design into a dynamically adaptable configuration
3Productivity
If blade cutting method is used to separate devices, then modular integration is achieved, but exposed pins must be on the same plane as cutting surface limiting application use
Solution Approach 1:
The encapsulation layer is designed with preliminary structural features that facilitate post-cutting pin manipulation, such as reinforced pin bases or protective coatings that allow pins to be bent or repositioned after the cutting process without damage
Solution Approach 2:
The physical state or configuration parameters of the pins are changed after cutting through thermal treatment, mechanical bending, or chemical processes that allow the pins to move from the cutting plane to different positions suitable for specific applications
Data Source
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AI summary
A semiconductor device assembly, a preparation method therefor, and a use thereof are provided. The semiconductor device assembly includes metal frames, semiconductor device units, and chip stages. The semiconductor device units include chips, pins, and connectors. The semiconductor device units are paired to form at least one semiconductor device pair, and are arranged in sequence along a length direction or a width direction of the metal frames. Encapsulation layers are arranged along an arrangement direction of the semiconductor device units. A redundant frame structure configured to carry and isolate single products of the metal frames is simplified, thereby increasing a density of the single products on each of the metal frames by at least 30%, facilitating cutting of the semiconductor device assembly, and facilitating bending of the pins exposed outside after cutting, so as to ensure that the pins meet design requirements in specific occasions.