Semiconductor Package Frame Groove for Resin Peeling Resistance
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Solution Overview
Problem
Conventional semiconductor devices face issues with peeling of thin sealing resin between the projection of the frame and the glass lid, which compromises the reliability of the packaging.
Innovation Solution
The semiconductor device incorporates a frame with projection portions and corresponding groove portions on its surface, ensuring a thick film of adhesive is maintained between the lid and the frame, preventing peeling by directing the adhesive into the groove and thus distributing stress effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a projection is provided on the frame to control sealing resin thickness, then the sealing resin thickness can be controlled during mounting, but the sealing resin becomes too thin and peels off
Solution Approach 1:
The patent applies the nesting principle by creating a groove structure within the frame's projection area. The groove is formed inside the projection, allowing the sealing resin to be nested within this recessed space. This nested structure enables the sealing resin to maintain adequate thickness while being contained within the projection's boundary, preventing peeling by providing a recessed bonding area rather than a protruding one.
2Manufacturing precision
If thin sealing resin is used between frame projection and glass lid, then mounting precision is improved, but adhesive bonding strength deteriorates
Solution Approach 1:
The patent applies the inversion principle by reversing the conventional approach: instead of using a protruding projection to control sealing resin thickness, the invention uses a recessed groove structure. This inverted geometry allows the sealing resin to accumulate in the groove, ensuring adequate thickness and bonding area, while the outer projection boundary still provides the necessary positioning and thickness control for mounting precision.
Data Source
AI summary
The present disclosure provides a semiconductor device capable of suppressing peeling of sealing resin, and an electric device. A semiconductor device according to a first aspect of the present disclosure includes: a substrate; a frame having a wall portion that is annularly arranged on the substrate and has a plurality of projection portions on an upper surface, the frame having a groove portion provided on the upper surface of the wall portion in correspondence to each of the projection portions; a semiconductor chip arranged in a region surrounded by the wall portion on the substrate; and a lid portion arranged on the upper surface of the wall portion and sealing the semiconductor chip.