Semiconductor Frame Structure for Heat Dissipation and Warpage Control
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Solution Overview
Problem
Highly integrated semiconductor packages face challenges in heat dissipation, leading to increased temperature and failure rates of semiconductor elements, especially in power semiconductor packages driven by high voltage and current.
Innovation Solution
A semiconductor frame and package design that includes a lead frame with a mounting portion, a wiring portion, and a lead-out portion, along with an insulating layer and a protective layer. The insulating layer, which can be made of polyimide, overlaps the mounting portion of the lead frame, while the protective layer, which can include metal materials like copper clad laminate, overlaps the insulating layer to enhance heat transfer and prevent warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation is improved in highly integrated semiconductor packages, then temperature of semiconductor elements is reduced and failure rate decreases, but device complexity increases due to additional insulating layers and protective layers
Solution Approach 1:
The patent combines multiple functional layers (insulating layer and protective layer) into a single integrated structure that serves both thermal management and mechanical protection functions, reducing overall device complexity while maintaining heat dissipation effectiveness
Solution Approach 2:
The patent uses composite material structures where the insulating layer and protective layer are composed of different materials with complementary properties - one optimized for thermal conduction and the other for mechanical strength and protection, achieving both heat dissipation and structural integrity
2Reliability
If thermal durability is maintained along with physical strength of support substrate, then reliability improves, but manufacturing process becomes complicated
Solution Approach 1:
The patent incorporates the insulating layer and protective layer into the support substrate structure before the semiconductor element is mounted, pre-establishing the thermal management and mechanical protection framework to simplify subsequent assembly processes
Solution Approach 2:
The support substrate structure is designed to simultaneously provide mechanical support, thermal management, and electrical insulation through integrated multi-functional layers, eliminating the need for separate dedicated components and simplifying manufacturing
3Reliability
If connection portions are protected from disconnection, then reliability improves, but device complexity increases due to additional protective structures
Solution Approach 1:
The protective layer is integrated with the insulating layer and support substrate to form a unified protective structure that safeguards connection portions without requiring separate protective components, maintaining simplicity while enhancing reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively dissipates heat generated by semiconductor elements, preventing performance degradation and warpage of the lead frame, while maintaining a simple manufacturing process and reducing manufacturing costs.
Implementation Method 1
an insulating layer that overlaps the mounting portion of the lead frame... effectively dissipates heat generated by semiconductor elements
Implementation Method 2
the protective layer, which can include metal materials like copper clad laminate, overlaps the insulating layer to enhance heat transfer
Data Source
AI summary
A semiconductor package is provided. The semiconductor package includes a first semiconductor frame that includes a first lead frame and a first insulating layer disposed below the first lead frame; a second semiconductor frame that includes a second lead frame that faces the first lead frame and a second insulating layer disposed on the second lead frame; a semiconductor element that is disposed between the first semiconductor frame and the second semiconductor frame; and a molding portion that surrounds and seals at least a portion of the first semiconductor frame, at least a portion of the second semiconductor frame, and the semiconductor element.