Semiconductor Module Frame Integration for Thermal Management
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Solution Overview
Problem
Conventional semiconductor devices face challenges in downsizing, reducing weight, and lowering costs due to the use of copper heatsinks, which require high rigidity and are expensive, and struggle with maintaining uniform thermal conductivity and stability under varying environmental temperatures.
Innovation Solution
A semiconductor device design that eliminates the need for a heatsink by fixing the semiconductor module to a frame part via a reinforcing beam, allowing direct heat discharge to a cooling member and reducing thermal resistance, while using a frame part made from materials like ABS or metal for increased rigidity and cost-effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper is used as the heatsink material to ensure high rigidity and thermal conductivity, then thermal conduction performance is improved, but device weight, size, and cost increase
Solution Approach 1:
The invention extracts and removes the separate heatsink component from the device structure. Instead of using a traditional copper heatsink, the frame part itself is designed to provide both structural support and thermal conduction functions, eliminating the need for a dedicated heatsink and thereby reducing device weight and complexity
Solution Approach 2:
The frame part is designed to serve multiple functions simultaneously: it provides mechanical support and rigidity for the semiconductor module while also serving as the thermal conduction path to dissipate heat. This multi-functional design eliminates the need for separate heatsink components and reduces overall device complexity
2Reliability
If copper is used as the heatsink material to ensure high rigidity, then thermal conduction performance is improved, but device cost increases
Solution Approach 1:
The invention removes the expensive copper heatsink component from the device structure and replaces it with a frame part made from cost-effective materials that can be manufactured using standard processes, thereby significantly reducing device cost while maintaining adequate thermal conduction performance
Solution Approach 2:
The invention replaces expensive copper materials with cheaper alternative materials for the frame part that can achieve the required thermal conduction performance at lower cost, making the device more economically viable without sacrificing essential functionality
3Volume of moving object
If heatsink thickness is reduced to achieve downsizing and weight reduction, then device size and weight decrease, but heatsink rigidity decreases causing deformation
Solution Approach 1:
The frame part is designed to simultaneously provide mechanical support and thermal conduction functions. By integrating these functions into a single component with optimized structure, the invention achieves adequate rigidity without requiring a thick separate heatsink, thereby enabling device downsizing while maintaining structural integrity
Solution Approach 2:
The invention uses composite material structures or optimized frame designs that provide high rigidity-to-weight ratios, allowing the heatsink or frame to maintain structural integrity at reduced thickness, thereby achieving device downsizing without sacrificing rigidity
4Reliability
If thermally conductive member thickness is reduced to improve thermal conduction, then thermal resistance decreases, but manufacturing precision requirements increase
Solution Approach 1:
The invention merges the thermally conductive function directly into the frame part structure itself, eliminating the need for separate thermally conductive members with critical thickness requirements. This integration reduces manufacturing precision requirements while maintaining effective thermal conduction through the frame's inherent structural contact
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves reductions in size, weight, and cost, while stabilizing performance by ensuring uniform pressure contact and effective heat dissipation, improving productivity and reducing component complexity.
Implementation Method 1
a thermally conductive member in the form of a paste or a flexible sheet is generally provided between the semiconductor module and the heatsink and between the heatsink and the cooling member for suppressing heat resistance
Implementation Method 2
the heat transferred to the heatsink is discharged to the outside via a cooling member attached to a reverse surface
Implementation Method 3
the heat transferred to the heatsink is discharged to the outside via a cooling member
Implementation Method 4
a plate-like presser spring disposed at one side of the semiconductor module
Data Source
AI summary
The present invention is intended to obtain a semiconductor device that is reduced in size, weight, and cost and improved in performance stability and productivity.The semiconductor device includes a semiconductor module in which a semiconductor element is sealed with a resin, a reinforcing beam fixed to an upper surface of the semiconductor module via a plate-like spring, and a frame part to which both ends of the reinforcing beam are fixed, the frame part being disposed in such a fashion as to enclose from four directions an outer periphery of the semiconductor module, plate-like spring, and the reinforcing beam.