Semiconductor Frame Screw Embedding for Inductance Reduction
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Solution Overview
Problem
Semiconductor devices with frames for external connection face challenges in reducing inductance, particularly in high-frequency operations, due to the length of the frame and the need for vibration resistance, which increases inductance and hinders effective eddy current cancellation.
Innovation Solution
The semiconductor device design includes a frame with a through hole for the screw's threaded section to protrude away from the base plate, allowing for a shorter wiring length and eliminating the need for a nut, while the frame's bent section connects to the circuit pattern for enhanced heat dissipation and vibration resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the nut is formed thick to increase frictional force and axial force between the screw and the nut for vibration resistance, then the vibration resistance is improved, but the inductance increases due to longer wiring length
Solution Approach 1:
The invention extracts the nut from the device structure, eliminating it entirely. The screw's threaded section directly engages with the externally exposed frame section, removing the intermediate nut component that would increase wiring length and inductance while providing vibration resistance through direct engagement.
Solution Approach 2:
The invention changes the dimensional arrangement by having the screw's threaded section extend in the thickness direction of the insulating substrate to directly engage the externally exposed frame section. This dimensional reconfiguration eliminates the need for a thick nut while maintaining vibration resistance through direct screw-to-frame engagement.
2Reliability
If the threaded section extends downward in the threaded section housing space to maintain insulation from the base plate, then the insulation is improved, but the inductance increases due to longer wiring length
Solution Approach 1:
The invention extracts the intermediate nut component that would require downward extension for insulation spacing. By eliminating the nut, the screw's threaded section can engage the frame directly at a shorter distance, maintaining insulation through the insulating substrate's thickness without the additional length required by a nut housing space.
Solution Approach 2:
The insulating substrate is preliminarily positioned between the screw's threaded section and the base plate to provide insulation. This preliminary insulation arrangement allows the threaded section to engage the frame at a shorter distance without requiring additional insulation space below the engagement point.
3Reliability
If the frame exposed section is disposed away from the base plate to maintain insulation distance, then the insulation is improved, but the inductance increases due to longer wiring length
Solution Approach 1:
The invention extracts the intermediate nut that would necessitate spacing the frame exposed section away from the base plate. By eliminating the nut, the frame exposed section can be positioned closer to the base plate while maintaining insulation through the insulating substrate, thereby reducing wiring length and inductance.
Solution Approach 2:
The insulating substrate serves as an intermediary between the screw's threaded section and the base plate, providing insulation without requiring additional spacing. This intermediary arrangement allows the frame exposed section to be positioned closer to the base plate, reducing wiring length while maintaining insulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design minimizes inductance, enhances vibration resistance, and improves heat resistance by shortening the frame's wiring length and allowing for effective eddy current cancellation, enabling higher frequency operations with reduced switching losses.
Implementation Method 1
a screw 4, and a frame 3... the screw 4 includes a threaded section 41... the frame 3 includes a frame through hole 32... the threaded section 41 is inserted into the frame through hole 32
Implementation Method 2
an insulating substrate 10... to maintain insulation from the base plate 1 with the insulating substrate 10 interposed therebetween
Data Source
AI summary
In the semiconductor device, a screw has a head section embedded in a case groove section provided in a frame placing stage of a case to cause side and front surfaces of the head section to be covered by the case, thereby fixing the screw to the case. A threaded section passes through a frame through hole of a frame exposed section disposed above the head section to protrude upward to be exposed on a side facing away from the base plate.