Semiconductor Module Support Frame Soldering for Leak-Tight Cooling
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Solution Overview
Problem
Existing semiconductor components face challenges in achieving effective cooling and robust fluid-tightness during the connection of semiconductor switches, particularly due to high temperatures and complex constructions associated with welding processes, which can damage wire bond connections and result in large, complex structures.
Innovation Solution
A semiconductor component design featuring a support frame with passages for semiconductor modules, where the base plate is soldered to the support frame using a solder with a suitable melting point, leveraging the capillary effect for a robust, fluid-tight bond, allowing for efficient cooling and assembly of multiple modules with reduced complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If welding is used to connect base plate to support frame, then strong mechanical bond is achieved, but high temperatures damage wire bond connections and increase device complexity
Solution Approach 1:
The patent changes the temperature parameter of the bonding process by using soldering instead of welding. The solder has a melting point (typically 180-300°C) significantly lower than welding temperatures (>1000°C), thereby achieving strong mechanical bonds without exposing wire bonds to damaging high temperatures. This parameter change resolves the contradiction between bond strength and device complexity.
2Reliability
If welding is used to ensure fluid-tightness, then robust sealing is achieved, but the structure becomes unnecessarily large and complex
Solution Approach 1:
The patent uses soldering instead of welding to achieve fluid-tight seals at lower temperatures. The solder flows into gaps and pores during the bonding process, creating reliable seals without requiring the complex high-temperature welding infrastructure. This simplifies the overall construction while maintaining fluid-tightness.
3Manufacturing precision
If smaller semiconductor assemblies are used, then individual components can be separately bonded and tested, but joint cooling for all semiconductor switches becomes complex
Solution Approach 1:
The patent merges multiple cooling functions into a unified cooling system. The support frame serves as a common cooling structure that provides joint cooling to all semiconductor modules through integrated cooling channels. This eliminates the need for separate cooling systems for each module, reducing overall cooling system complexity while enabling individual module bonding and testing.
Solution Approach 2:
The support frame is designed with multi-functionality: it provides mechanical support, electrical isolation, and unified cooling for all semiconductor modules. The cooling channels in the support frame serve all modules simultaneously, reducing the overall cooling system complexity while allowing individual modules to be separately assembled and tested.
4Reliability
If base plate rests on edge of passage with soldering, then complete sealing of cooling duct is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The patent uses solder as an intermediary material between the base plate and support frame. The solder compensates for minor misalignments and gaps, achieving complete sealing of cooling ducts without requiring extremely high manufacturing precision. The solder flows into irregularities and gaps during bonding, ensuring reliable seals while tolerating reasonable manufacturing variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient cooling of semiconductor modules with a robust, fluid-tight seal at lower temperatures, preventing damage to wire bonds and simplifying the assembly of semiconductor components, while allowing for the use of sintered modules with reduced complexity and improved thermal management.
Implementation Method 1
the liquefied solder is drawn into the intermediate space by the capillary effect acting between the two plate-shaped regions resting on one another
Implementation Method 2
The base plate is soldered to the support frame
Data Source
AI summary
A semiconductor component, including a support frame and at least one semiconductor module attached to the support frame, wherein the support frame includes a respective passage (on the edge of which a base plate of the semiconductor module rests, wherein the base plate is soldered to the support frame.