Semiconductor Device Frame Member UV Curing Bonding
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Solution Overview
Problem
The existing semiconductor devices with a semiconductor chip mounted on a wiring substrate and covered by a frame and cover member face reliability issues due to peeling at the bonding interface between the frame and cover members, particularly caused by moisture vaporization from glass fibers in the frame member during reflow and ultraviolet-ray curing processes.
Innovation Solution
The semiconductor device manufacturing method involves flattening the upper surface of the frame member to reduce the roughness and distance between the glass fibers and the bonding interface, using a bonding material that can be cured with ultraviolet rays, and ensuring the frame member's surface is as flat as or flatter than the insulating film's surface to prevent moisture infiltration and peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the frame member contains glass fibers to provide structural strength, then the mechanical strength is improved, but moisture vaporization during reflow and ultraviolet-ray curing causes peeling at the bonding interface, reducing reliability
Solution Approach 1:
The invention applies different surface quality requirements to different regions of the frame member. The upper surface (bonding surface) is specifically designed to be flat with controlled roughness to prevent peeling, while the frame member internally maintains glass fibers for structural strength. This local differentiation of surface quality resolves the contradiction between mechanical strength and bonding reliability.
Solution Approach 2:
The invention performs preliminary surface treatment of the frame member's upper surface before bonding to ensure flatness and control roughness. By preparing the bonding surface in advance with appropriate flatness (Ra ≤ 0.8 μm) and roughness characteristics, the invention prevents moisture infiltration and peeling during subsequent reflow and ultraviolet-ray curing processes, thereby maintaining bonding interface reliability while preserving the glass fiber-reinforced structural strength.
2Strength
If the upper surface of the frame member is made rough to increase bonding area, then bonding strength is improved, but moisture infiltration increases causing peeling during thermal processes
Solution Approach 1:
The invention carefully balances the local surface quality of the frame member's upper surface. Rather than making it uniformly rough, the invention specifies controlled roughness (Ra ≤ 0.8 μm) that provides sufficient bonding area while maintaining a surface topology that prevents moisture infiltration. This localized surface engineering resolves the contradiction between bonding strength and moisture resistance.
Solution Approach 2:
The invention changes the surface roughness parameter to an optimal value (Ra ≤ 0.8 μm) that simultaneously achieves adequate bonding strength and prevents moisture infiltration. By precisely controlling this physical parameter, the invention resolves the contradiction between increasing bonding area through roughness and preventing harmful moisture infiltration during thermal processing.
3Reliability
If the frame member surface is made very flat to prevent moisture infiltration, then reliability is improved, but the distance between glass fibers and bonding interface increases, potentially reducing structural efficiency
Solution Approach 1:
The invention applies local quality differentiation by controlling the upper surface flatness (Ra ≤ 0.8 μm) specifically at the bonding interface region, while allowing the internal structure to maintain its glass fiber reinforcement for structural efficiency. This localized surface control ensures bonding interface integrity without compromising the overall structural design, as the flatness requirement applies only to the bonding surface rather than the entire frame member thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of the semiconductor device by reducing peeling at the bonding interface, improving the bonding strength, and maintaining the integrity of the resin during thermal and curing processes, thereby increasing the device's overall performance.
Implementation Method 1
a step of curing the bonding material by irradiating the bonding material fixed on the frame member with ultraviolet ray
Data Source
AI summary
A performance of a semiconductor device is improved. A method of manufacturing a semiconductor device according to one embodiment includes a step of mounting a cover member via a bonding material on an upper surface of a frame member fixed on a wiring substrate, and a step of curing the bonding material by irradiating the bonding material mounted on the frame member with an ultraviolet ray. The wiring substrate has a base member and an insulating film covering the base member, and the frame member and a semiconductor chip are mounted (fixed) onto an upper surface of the insulating film. The frame member contains glass fibers. Moreover, a roughness of the upper surface of the frame member is equal to or less than a roughness of the upper surface of the insulating film.