Semiconductor Package Frame Warpage Prevention
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Solution Overview
Problem
The existing semiconductor packages for high-power internal matching circuits in microwave amplifiers face issues with warpage due to differing linear expansion coefficients, leading to gaps between the base plate and housing, which degrade high-frequency characteristics and reliability.
Innovation Solution
A semiconductor package design featuring a base plate with a smaller size and larger linear expansion coefficient, surrounded by a frame with a smaller linear expansion coefficient, where the screwing portion is integrated into the frame, allowing for a smaller base plate and preventing warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the screwing portion is provided in the base plate, then the semiconductor package can be mounted in the housing, but the base plate size must be increased which causes warpage due to linear expansion coefficient difference
Solution Approach 1:
The patent divides the mounting structure into two separate components: the base plate and the frame. The screwing portion is relocated from the base plate to the frame, allowing the base plate to maintain its original size and flatness while the frame provides the mounting function. This segmentation resolves the contradiction by separating the mounting function from the base plate structure.
Solution Approach 2:
The frame acts as an intermediary component between the base plate and the housing. It provides the screwing portion for mounting while having a smaller linear expansion coefficient than the base plate, thereby preventing warpage. The frame mediates between the mounting requirement and the base plate's dimensional stability.
2Ease of manufacture
If the base plate size is increased to provide screwing portion, then mounting is enabled, but high-frequency characteristics deteriorate due to gap generation
Solution Approach 1:
By segmenting the mounting function into the frame rather than the base plate, the invention maintains the base plate's original size, preventing gap generation between the base plate and housing. This preserves the ground path integrity and maintains high-frequency characteristics while still enabling mounting through the frame's screwing portion.
3Manufacturing precision
If the base plate size is reduced, then warpage is prevented, but mounting capability is lost
Solution Approach 1:
The frame serves as an intermediary that carries the screwing portion, enabling mounting capability to be transferred from the base plate to the frame. This allows the base plate to be smaller and prevent warpage while the frame provides the necessary mounting function through its integrated screwing portion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances adhesion between the base plate and housing, improving high-frequency characteristics and reliability by eliminating warpage and providing a corrective force for the base plate, thus ensuring better grounding.
Implementation Method 1
the base plate has a larger linear expansion coefficient than other members such as a matching circuit substrate or a transistor to be mounted. Due to the difference in linear expansion coefficient, the semiconductor package may warp in high-temperature treatment
Data Source
AI summary
A transistor (2) and a matching circuit substrate (3-6) are provided on a base plate (1) and connected to each other. A frame (15) is provided on the base plate (1) and surrounds the transistor (2) and the matching circuit substrate (3-6). The frame (15) has a smaller linear expansion coefficient than that of the base plate (1). A screwing portion (17) is provided in the frame (15). A size of the base plate (1) is smaller than that of the frame (15).