Semiconductor Refrigerator Phase-Change Cooling Without Fan Noise
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Solution Overview
Problem
Existing semiconductor refrigerators face inefficiencies in heat exchange due to low heat conduction and exchange efficiency between solid bodies, leading to bulky designs, increased noise, and reduced reliability from continuous fan operation.
Innovation Solution
The semiconductor refrigerator employs multiple cold end heat exchanging devices with three refrigerant pipelines, each with an evaporation section thermally connected to the rear and side walls, facilitating phase-change heat exchange and eliminating the need for a fan, thereby enhancing heat exchange efficiency and reducing noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a heat radiator with forced convection is used to transfer heat from the semiconductor cooler, then heat exchange can be achieved, but the heat conduction and exchange efficiency is low and the design becomes bulky
Solution Approach 1:
The patent replaces the mechanical forced convection system (heat radiator with fan) with a phase-change heat exchange system. The refrigerant undergoes phase change (liquid to gas) in the evaporation section, absorbing heat from the semiconductor cooler through thermal conduction and convection, eliminating the need for mechanical fans and bulky heat dissipation fins while improving heat exchange efficiency
Solution Approach 2:
The patent utilizes phase transition of refrigerant (from liquid to gas in evaporation section) to enhance heat exchange efficiency. The phase change process absorbs latent heat effectively, allowing compact heat exchange without requiring large surface area heat dissipation fins
2Loss of energy
If a fan is combined with heat dissipation fins for forced convection, then heat exchange is improved, but noise is increased
Solution Approach 1:
The patent eliminates the mechanical fan system by using phase-change heat exchange. The refrigerant's phase transition and natural convection currents replace the mechanical forcing action of the fan, achieving effective heat exchange without generating noise from rotating mechanical components
3Loss of energy
If a fan operates continuously for heat dissipation, then heat exchange is maintained, but reliability is reduced
Solution Approach 1:
The patent replaces the continuous operation mechanical fan with a passive phase-change heat exchange system. The refrigerant cycle (evaporation and condensation) naturally maintains heat exchange without requiring continuous mechanical operation, eliminating wear and failure risks associated with continuous fan operation
Solution Approach 2:
The phase-change heat exchange system operates autonomously based on temperature differences and pressure gradients. The refrigerant naturally evaporates at the cold end and condenses at the hot end, creating self-sustaining heat exchange without requiring external mechanical control or continuous operation
4Loss of energy
If direct contact heat exchange between solid bodies is used, then heat transfer is achieved, but heat conduction efficiency is low
Solution Approach 1:
The patent introduces a refrigerant fluid system to enhance heat exchange. The refrigerant flows through pipelines, absorbing heat from the semiconductor cooler through conduction and convection, and releases heat through phase change, significantly improving heat transfer efficiency compared to solid-to-solid conduction
Solution Approach 2:
The refrigerant undergoes phase change (liquid to gas) in the evaporation section, utilizing latent heat absorption to dramatically improve heat exchange efficiency. This phase transition mechanism allows effective heat transfer without requiring complex heat exchange structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves energy efficiency, reduces noise, and increases the reliability of the semiconductor refrigerator by maximizing the heat exchange area and utilizing the refrigerator structure for efficient heat conduction without the need for a fan.
Implementation Method 1
configured to allow the refrigerant to flow therein and undergo phase-change heat exchange
Implementation Method 2
each refrigerant pipeline having an evaporation section which is downwardly bent
Implementation Method 3
the evaporation sections of the three refrigerant pipelines of each of the cold end heat exchanging devices being thermally connected to the rear wall and two side walls of the liner respectively
Data Source
AI summary
A semiconductor refrigerator, which comprises: a liner; at least one semiconductor cooler; and a plurality of cold end heat exchanging devices, each of which is configured to allow the refrigerant to flow therein and undergo phase-change heat exchange to transfer cold from the cold end of the semiconductor cooler to the storage compartment of the liner. Each of the cold end heat exchanging devices has three refrigerant pipelines, each refrigerant pipeline having an evaporation section which is downwardly bent and extends in a vertical plane and has a closed tail end, the evaporation sections of the three refrigerant pipelines of each of the cold end heat exchanging devices being thermally connected to the rear wall and two side walls of the liner respectively.