Semiconductor Fuse Structure With Segmented Branches
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Solution Overview
Problem
As semiconductor processes become smaller and more complex, they are increasingly susceptible to impurities, leading to defects that can render entire chips unusable, necessitating the development of effective fuse structures for selective repair and customization.
Innovation Solution
The fabrication of semiconductor devices with fuse branches of different sizes, separated by shallow trench isolation, and connected by fuse elements that can be disconnected using a laser beam, allowing for controlled resistance values through varying lengths and widths of the fuse branches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If fuse branches of different sizes are used to control resistance values, then customization capability is improved, but device complexity increases
Solution Approach 1:
The fuse structure is segmented into multiple fuse branches (first fuse branches and second fuse branches) with different sizes, where each branch can be independently configured to provide different resistance values. This segmentation allows customization of resistance characteristics while maintaining a modular structure that manages complexity through systematic organization.
Solution Approach 2:
Different fuse branches are designed with different local qualities (different sizes and resistance characteristics) to meet specific customization requirements. The first fuse branches and second fuse branches have distinct dimensions and electrical properties, allowing precise control of resistance values in different regions of the fuse structure.
2Manufacturing precision
If fuse branches are separated by shallow trench isolation, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
Shallow trench isolation structures are introduced as intermediary elements between the first fuse branches and second fuse branches. These isolation structures serve as mediators that physically separate and electrically isolate different fuse branches, enabling precise control of electrical characteristics while providing a systematic framework for manufacturing.
3Ease of repair
If fuse elements are designed to be disconnected by laser beam irradiation, then ease of repair is improved, but reliability during operation may worsen
Solution Approach 1:
The fuse elements are designed with specific material and structural parameters that create a differential response to thermal energy: under normal operating conditions, the parameters ensure stable conduction and high reliability, but when exposed to laser beam irradiation with sufficient energy density, the parameters enable controlled disruption through electro-migration or melting, facilitating repair operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise control of resistance values in fuse structures, enhancing their operational stability and performance by ensuring consistent resistance measurements across fuse elements, thereby improving the yield and customization of IC manufacturing.
Implementation Method 1
fuse elements that can be disconnected by irradiating a laser beam
Implementation Method 2
An electrical fuse utilizes electro-migration for both forming open circuits and for repairing
Data Source
AI summary
A method for fabricating semiconductor device is disclosed. First, a substrate is provided, and first fuse branches and second fuse branches are formed in the substrate, in which the first fuse branches and the second fuse branches are separated by a shallow trench isolation (STI) and the second fuse branches include different sizes. Next, fuse elements are formed to connect the first fuse branches and the second fuse branches.