Semiconductor Module Gate Electrode Connection via Segmented Substrate
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Solution Overview
Problem
In semiconductor modules with a power device part and control IC, the existing designs face challenges in connecting the gate electrode of the power device part with the output terminal of the control IC using a connecting member of small diameter, especially when a second substrate is positioned over a large portion of the power device part.
Innovation Solution
The semiconductor module design includes a first substrate with a power device part having a gate electrode positioned outside the surrounding wall portion, allowing connection to an output terminal of the control IC through a connecting member with a small diameter, while the second conductor layer's surrounding wall portion provides fire protection and noise shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the second substrate is positioned over a large portion of the power device part, then the fire protection and noise shielding are improved, but the connection between the gate electrode and control IC output terminal becomes difficult
Solution Approach 1:
The second substrate is divided into a substrate body and a surrounding wall portion. The surrounding wall portion is separated from the substrate body and positioned to surround the bonding portion, creating a segmented structure that provides noise shielding while leaving the gate electrode accessible for connection.
Solution Approach 2:
The surrounding wall portion is positioned only at specific locations around the bonding portion rather than covering the entire substrate. This localized structure provides fire protection and noise shielding where needed while maintaining accessibility for electrical connections.
2Object-affected harmful factors
If the surrounding wall portion is formed to surround the bonding portion, then the fire protection is improved, but the device complexity increases
Solution Approach 1:
The surrounding wall portion is formed as an integrated part of the second substrate structure, merging the substrate function with the fire protection function. This eliminates the need for separate fire protection components, reducing overall device complexity.
Solution Approach 2:
The second substrate serves multiple functions: it provides mechanical support, electrical connection (through the bonding portion), fire protection (through the surrounding wall portion), and noise shielding. This multi-functionality reduces the need for additional components.
Data Source
AI summary
A semiconductor module includes: a first substrate having a first insulating substrate and a first conductor layer; a power device part having a first electrode, a second electrode and a gate electrode; a second substrate having a second insulating substrate and a second conductor layer, wherein the second conductor layer has a bonding portion and a surrounding wall portion formed at a position which surrounds the bonding portion as viewed in a plan view; an inner resin portion; a control IC; and an outer resin portion, wherein the power device part is disposed such that the gate electrode is positioned outside a region defined by the surrounding wall portion as viewed in a plan view, and the gate electrode is electrically connected to an output terminal of the control IC through a connecting member.