Semiconductor Package Gel Layer Guard Ring Field Control
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Solution Overview
Problem
The packaging of thin-type power semiconductor chips faces challenges in maintaining high reliability and yield due to high current density and non-uniform heat dissipation, exacerbated by the small contact area between bonding wires and chips, leading to localized electrical field effects that reduce withstand voltage.
Innovation Solution
Incorporating a gel layer between the guard ring and the lead frame in the semiconductor package structure, which reduces electrical field effects, enhances heat and current transmission uniformity, and supports the structure without requiring new manufacturing processes, using insulating materials like silicone gel or epoxy resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If thin-type power semiconductor chips are used to reduce size, then device miniaturization is achieved, but withstand voltage decreases due to localized electrical field effects
Solution Approach 1:
A gel layer is introduced as an intermediary substance between the guard ring and lead frame. This gel layer has specific electrical properties that moderate the electrical field distribution, preventing excessive field concentration at the guard ring edges while maintaining the compact chip structure. The gel acts as a mediator that decouples the direct interaction between the guard ring and lead frame, thereby preserving withstand voltage in miniaturized devices.
2Volume of moving object
If bonding wire contact area is reduced for miniaturization, then device size decreases, but heat dissipation uniformity deteriorates
Solution Approach 1:
The gel layer is extracted and placed between the guard ring and lead frame to perform the function of electrical field modulation and heat distribution. By separating the bonding wire contact function from the heat dissipation function, the gel layer compensates for the reduced heat dissipation capability caused by smaller contact areas, thereby maintaining temperature uniformity despite device miniaturization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases the withstand voltage, improves heat dissipation, reduces current density, and enhances the stability and performance of the semiconductor package by maintaining uniform temperature and current distribution, while being easily adaptable to various chip sizes and shapes.
Implementation Method 1
the gel layer is located between the guard ring and the first lead frame, such that the electrical field effects around the guard ring can be lowered
Implementation Method 2
improves heat dissipation, reduces current density, and enhances the stability and performance of the semiconductor package by maintaining uniform temperature
Data Source
AI summary
A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor chip, a guard ring, a gel layer, and a first lead frame. The guard ring is disposed on the semiconductor chip, and the gel layer is disposed on the guard ring. The first lead frame is electrically connected to the semiconductor chip, and the gel layer is located between the guard ring and the first lead frame.