Semiconductor GMI Magnetometer Size Reduction

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Solution Overview

Problem

Current GMI magnetometers are bulky and expensive to manufacture, necessitating a smaller and less expensive alternative.

Innovation Solution

A semiconductor-based GMI magnetometer is developed, incorporating a semiconductor structure with a processing circuit, a magnetic structure with high permeability, and a sense coil formed using metal and non-conductive layers, reducing size and cost through semiconductor processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If traditional GMI magnetometer design is used, then sensitivity is maintained, but size and manufacturing cost increase

Engineering Contradiction:
ImprovesensitivityVSAvoidsize
Core Design Contradiction:
Measurement precisionVSVolume of moving object

Solution Approach 1:

The patent combines the soft ferromagnetic structure, sense coil, and processing circuit into a single integrated semiconductor device. The soft ferromagnetic structure and sense coil are formed on the same semiconductor substrate using sequential deposition and patterning processes, eliminating the need for separate components and reducing overall device size while maintaining the GMI sensing functionality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The sense coil is configured to wrap around or enclose the soft ferromagnetic structure in a nested arrangement. This nesting allows the sense coil to be positioned in close proximity to the ferromagnetic structure, maximizing magnetic coupling and sensing sensitivity while minimizing the lateral footprint of the device.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Measurement precision

If traditional GMI magnetometer design is used, then sensitivity is maintained, but manufacturing cost increases

Engineering Contradiction:
ImprovesensitivityVSAvoidmanufacturing cost
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The patent combines the soft ferromagnetic structure, sense coil, and processing circuit into a single integrated semiconductor device. The soft ferromagnetic structure and sense coil are formed on the same semiconductor substrate using sequential deposition and patterning processes, eliminating the need for separate components and reducing overall device size while maintaining the GMI sensing functionality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent uses sputtering deposition to form the soft ferromagnetic structure with controlled thickness (e.g., 1-10 micrometers) and specific magnetic properties. By controlling deposition parameters such as power, pressure, and composition ratios, the manufacturing process achieves consistent magnetic performance across batches, reducing variability and rework costs.

Inventive Principle:
Principle #35Parameter changes

3Measurement precision

If soft ferromagnetic structure with high permeability is used, then impedance change increases, but device complexity increases

Engineering Contradiction:
Improveimpedance changeVSAvoiddevice complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent uses sputtering deposition to form the soft ferromagnetic structure with controlled thickness (e.g., 1-10 micrometers) and specific magnetic properties. By controlling deposition parameters such as power, pressure, and composition ratios, the manufacturing process achieves consistent magnetic performance across batches, reducing variability and rework costs.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The semiconductor GMI magnetometer achieves a significant reduction in size and cost while maintaining sensitivity, allowing for multiple sensors to be connected in parallel for enhanced performance.

Implementation Method 1

The alternating current passing through soft ferromagnetic structure 110 generates an alternating magnetic field, which changes in response to changes in the impedance of soft ferromagnetic structure 110

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Implementation Method 2

The alternating magnetic field induces an alternating current and an alternating voltage in sense coil 114 that tracks the alternating current passing through soft ferromagnetic structure 110

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS8680854B2Semiconductor GMI magnetometer
Publication Date: 2014.03.25 TEXAS INSTRUMENTS INC
  • US8680854B2 patent drawing
  • US8680854B2 patent drawing
  • US8680854B2 patent drawing

AI summary

A giant magneto-impedance (GMI) magnetometer is formed in a semiconductor wafer fabrication sequence, which significantly reduces the size and cost of the GMI magnetometer. The semiconductor wafer fabrication sequence forms a magnetic conductor, a non-magnetic conductor that is wrapped around the magnetic conductor as a coil, and non-magnetic conductors that touch the opposite ends of the magnetic conductor.