Semiconductor device, method of manufacturing the same, and LED display device
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Solution Overview
Problem
Semiconductor devices with light emitting elements face challenges in achieving high positional accuracy during bonding due to air bubbles forming between the semiconductor elements and the substrate, which hinders precise alignment and transfer.
Innovation Solution
A semiconductor device design featuring a planarized layer with insulating properties, where semiconductor elements are formed on one surface and a groove is created on the opposite surface outside the elements, allowing for air dispersal and preventing bubble formation during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a bonding object is bonded to a bonded object after production, then the bonding process can be completed, but air bubbles occur which prevent high positional accuracy
Solution Approach 1:
The patent extracts air from the bonding interface by forming through-holes through the bonding object. These through-holes allow air bubbles to escape during the bonding process, preventing air accumulation that would otherwise hinder high positional accuracy. The through-holes are created by removing portions of the bonding object in regions that do not overlap with the bonded object when viewed from the bonding direction.
Solution Approach 2:
The patent introduces an intermediary structure (through-holes) that facilitates air removal during bonding. These holes act as channels that mediate the escape of air from the bonding interface, enabling the bonding process to proceed without air bubble interference while maintaining positional accuracy.
2Reliability
If air bubbles are present during bonding, then bonding can still occur, but positional accuracy deteriorates
Solution Approach 1:
The through-holes extract air from the bonding interface, ensuring that bonding can complete reliably without air bubble interference. This extraction mechanism simultaneously improves positional accuracy by preventing air from disrupting the alignment and bonding process.
Solution Approach 2:
The patent converts the potentially harmful presence of air bubbles into a beneficial outcome by designing through-holes that actively manage air removal. The air that would otherwise cause positioning errors is now channeled through predetermined paths, transforming a harmful factor into a controlled aspect of the bonding process.
3Manufacturing precision
If the bonding object is made without through-holes, then manufacturing is simpler, but air bubbles prevent high positional accuracy
Solution Approach 1:
The through-holes are formed by removing portions of the bonding object, which can be achieved through straightforward manufacturing processes such as etching or drilling. This extraction approach adds minimal structural complexity while dramatically improving positional accuracy by enabling air removal.
Solution Approach 2:
The bonding object is designed with a porous structure (through-holes) that facilitates air removal. This porous design is simple to implement and does not significantly increase device complexity, while effectively preventing air bubble formation during bonding.
Data Source
AI summary
A semiconductor device includes: a planarized layer having insulating properties, the planarized layer having a first surface and a second surface opposite the first surface; a plurality of semiconductor elements formed on the first surface of the planarized layer; and a groove provided in the second surface of the planarized layer. The groove is formed in a region outside the plurality of semiconductor elements as viewed in a direction perpendicular to the first surface.