Semiconductor Chip Groove Heat Dissipation
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Solution Overview
Problem
Semiconductor stack packages face challenges in effectively dissipating heat generated during operation, which can lead to reduced performance and reliability due to inadequate heat management.
Innovation Solution
The semiconductor chip design incorporates a groove pattern on the bottom surface with through electrodes and a heat dissipation pattern filled within the groove, along with heat dissipation members on the side surfaces, utilizing materials like copper, aluminum, or gold for enhanced heat transfer, and additional insulation and heat transfer adhesives to facilitate efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor chips are stacked to increase data capacity, then data processing capability is improved, but heat accumulation increases and heat dissipation becomes more difficult
Solution Approach 1:
The patent introduces groove patterns on the bottom surface of semiconductor chips that extend from edges toward the center, creating vertical depth dimension for heat dissipation. Through electrodes are formed to extend through these grooves, and heat dissipation patterns are filled in the grooves to create three-dimensional heat dissipation pathways, transforming traditional two-dimensional surface heat dissipation into multi-dimensional heat management.
Solution Approach 2:
The patent employs heat dissipation patterns filled with heat dissipation materials (such as copper, aluminum, or gold) as intermediary structures between the semiconductor chip body and external environment. These heat dissipation patterns act as thermal conductors that intercept heat from the chip and transfer it to heat dissipation members or external heat sinks, facilitating efficient heat removal from the stacked package.
2Temperature
If heat dissipation structures are added to semiconductor chips, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into integrated structures: the groove pattern serves both as a structural feature for heat dissipation and as a template for forming through electrodes and heat dissipation patterns. The heat dissipation patterns are formed to fill the groove patterns and connect with through electrodes, merging thermal management functions with existing chip interconnection structures, thereby reducing overall device complexity while improving heat dissipation.
Solution Approach 2:
The through electrodes serve dual purposes: providing electrical interconnections between stacked chips and acting as thermal conduction pathways for heat dissipation. The groove patterns simultaneously provide structural support, define heat dissipation material placement, and facilitate both electrical and thermal functions, reducing the need for separate dedicated heat dissipation structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively dissipates heat both horizontally and vertically, improving the performance and reliability of semiconductor chips and packages by increasing the contact area and using materials with high thermal conductivity, thereby managing heat effectively.
Implementation Method 1
A heat dissipation pattern is formed to fill in the groove pattern defined on the bottom surface and to connect with the through electrodes... utilizing materials like copper, aluminum, or gold for enhanced heat transfer
Data Source
AI summary
A semiconductor chip includes a semiconductor chip body having a top surface, a bottom surface, and side surfaces. The bottom surface may have a groove pattern defined by removing a partial thickness of the semiconductor chip body to extend from one or more edges of the semiconductor chip body toward a center portion of the semiconductor chip body. Through electrodes may be formed to extend from the top surface of the semiconductor chip body and pass through the groove pattern defined on the bottom surface. A heat dissipation pattern may fill in the groove pattern defined on the bottom surface and may be connected with the through electrodes.