Semiconductor Package Groove for Metal Plate Positioning
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Solution Overview
Problem
The existing semiconductor devices face challenges in maintaining positioning accuracy of internal connection terminals due to their separate configuration from external lead terminals, leading to potential inaccuracies.
Innovation Solution
The semiconductor device integrates first and second metal plates through a connection portion, which is then covered with sealing resin and features a groove to improve positioning accuracy, with the metal plates being exposed from the resin to facilitate precise alignment and connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If external lead terminals and internal connection terminal are separate bodies, then ease of manufacture is improved, but positioning accuracy of the internal connection terminal deteriorates
Solution Approach 1:
The patent merges the external lead terminals and internal connection terminal into a single integrated lead frame structure. This integration ensures that the internal connection terminal maintains precise positioning relative to the semiconductor chip, as both components are formed as one piece rather than separate assemblies. The lead frame serves dual functions: external connectivity and internal positioning support.
2Manufacturing precision
If a groove is formed in the sealing resin to expose metal plate ends, then positioning accuracy is improved, but device complexity increases
Solution Approach 1:
The groove is pre-formed in the sealing resin during the packaging process, before final assembly completion. This preliminary action allows the metal plate ends to be exposed at precise locations, ensuring accurate positioning of electrical connections without requiring additional post-processing steps. The groove formation is integrated into the standard encapsulation workflow.
3Reliability
If metal plates are exposed from sealing resin, then assembly reliability is improved, but processing time increases
Solution Approach 1:
The sealing resin is segmented by forming grooves that create distinct exposed regions for the metal plate ends. This segmentation allows selective exposure of only the necessary connection areas, maintaining assembly reliability through precise positioning while minimizing the amount of resin removal required, thus reducing processing time compared to complete resin removal approaches.
Data Source
AI summary
A semiconductor device according to the disclosure includes a first semiconductor chip, a second semiconductor chip, a first metal plate provided on an upper surface of the first semiconductor chip, a second metal plate provided on an upper surface of the second semiconductor chip and a sealing resin covering the first semiconductor chip, the second semiconductor chip, the first metal plate and the second metal plate, wherein a groove is formed in the sealing resin, the groove extending downwards from an upper surface of the sealing resin, the first metal plate includes, at an end facing the second metal plate, a first exposed portion exposed from a side face of the sealing resin forming the groove, and the second metal plate includes, at an end facing the first metal plate, a second exposed portion exposed from a side face of the sealing resin forming the groove.