Semiconductor Device Groove Recess-Projection Anchor

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Solution Overview

Problem

Conventional semiconductor devices face challenges in miniaturization and productivity due to the large area occupied by grooves on the mounting surface of the lead frame, which complicates the contact area and deteriorates the fixed state between the outer packaging resin and the base.

Innovation Solution

The semiconductor device incorporates a groove on the base with a first recess-projection and a second recess-projection, providing a varying depth and complex contact surface that increases the anchor effect between the outer packaging resin and the base, allowing for a stronger fixed state while maintaining miniaturization and high productivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a plurality of grooves or hook-shaped grooves is provided on the mounting surface to increase contact area, then the fixed state between outer packaging resin and lead frame is improved, but the area occupied by grooves increases making miniaturization difficult

Engineering Contradiction:

Improvefixed stateVSAvoidmounting surface area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The invention transitions from a two-dimensional groove pattern on the surface to a three-dimensional recess-projection structure with varying depths. The bottom of the groove includes recess-projections that extend downward, creating vertical dimensionality that increases contact area without occupying additional horizontal mounting surface area.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The recess-projections are nested within the groove structure, with smaller recesses containing projections that extend into the outer packaging resin. This nested configuration maximizes the contact interface within the available vertical space, increasing anchoring effect without requiring additional horizontal space.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Reliability

Engineering Contradiction:

Improvefixed stateVSAvoidlead frame productivity

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The groove bottom is segmented into multiple recess-projections with different depths and positions. This segmentation creates a complex contact surface that enhances mechanical interlocking with the outer packaging resin, improving the fixed state while the modular structure allows for efficient manufacturing through standardized forming processes.

Inventive Principle:

Principle #1Segmentation

3Reliability

If the contact area between outer packaging resin and groove is increased, then the fixed state is improved, but the groove occupies large area making miniaturization difficult

Engineering Contradiction:

Improvefixed stateVSAvoiddevice volume

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The invention utilizes the vertical dimension by creating recess-projections with varying depths from the groove bottom. This vertical development increases the contact area between the groove and outer packaging resin without expanding the horizontal footprint, enabling miniaturization while maintaining strong fixation.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the reliability of the sealed state by increasing the contact area and anchor effect, improving heat transfer characteristics and heat dissipation efficiency, and stabilizing the fixed state under external forces.

Implementation Method 1

a contact area between the outer packaging resin and the groove becomes large, and a shape of a contact surface between the outer packaging resin and the groove becomes complicated. This increases an anchor effect between the outer packaging resin and the groove.

Methodology Applied

Scientific EffectAnchor effect: Mechanical Fastener

Data Source

PatentUS10297516B2Semiconductor device

Publication Date: 2019.05.21 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

AI summary

A semiconductor device includes a semiconductor element, a base, and an outer packaging resin. The base has a mounting surface, on which the semiconductor element is mounted, and a groove provided around the semiconductor element on the mounting surface. An outer packaging resin covers the semiconductor element and the base, and is fixed to the base by filling the groove. A bottom of the groove includes a first recess-projection having a first amplitude and a first repetition interval along an extending direction of the groove. The first recess-projection includes a second recess-projection having a second amplitude smaller than the first amplitude and a second repetition interval shorter than the first repetition interval along the extending direction of the groove.