Semiconductor Package Groove Structure for Resin Bleed Control
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Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to inadequate performance.
Innovation Solution
The implementation of a conductive structure with a roughening and grooves having smoothed sidewalls, along with an encapsulant that covers the electronic component and conductive structure, enhances adhesion and prevents resin bleed, thereby improving reliability and reducing package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packages are used, then manufacturing is simpler, but reliability decreases and package size increases
Solution Approach 1:
The patent applies preliminary action by forming grooves in the conductive structure before attaching the electronic component. These pre-formed grooves create designated pathways that control resin flow during encapsulation, preventing resin bleed while maintaining reliable adhesion. The roughening of the conductive structure surface is also performed in advance to enhance mechanical interlocking with the encapsulant.
Solution Approach 2:
The patent segments the conductive structure surface by creating grooves that divide the surface into distinct regions. This segmentation controls the distribution and flow of encapsulant resin, ensuring proper filling while preventing excessive resin migration. The grooves effectively partition the encapsulation space to manage resin behavior during curing.
2Reliability
If conventional packages are used, then manufacturing cost is lower, but performance is inadequate
Solution Approach 1:
The grooves are formed in advance during lead frame fabrication, enabling automated manufacturing processes. This preliminary structuring allows subsequent encapsulation to proceed efficiently with standard molding equipment, maintaining ease of manufacture while achieving superior performance through controlled resin distribution and enhanced adhesion.
Solution Approach 2:
The patent applies local quality by roughening specific areas of the conductive structure surface to enhance adhesion locally where the encapsulant contacts it. The grooves are strategically positioned to control resin flow in critical areas, providing localized quality enhancement that improves overall package performance without requiring complete restructuring of the entire package.
3Strength
If conventional packages are used, then package size is larger, but adhesion is insufficient
Solution Approach 1:
The roughening is applied locally to the conductive structure surface areas that contact the encapsulant, creating enhanced mechanical interlocking zones. This localized surface modification significantly improves adhesion strength without requiring increased package volume, as the enhancement is concentrated at the critical interface between the conductive structure and encapsulant.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances adhesion between the encapsulant and the conductive structure, preventing resin bleed and delamination, resulting in improved reliability and smaller package sizes while maintaining performance.
Implementation Method 1
enhances adhesion between the encapsulant and the conductive structure
Implementation Method 2
prevents resin bleed
Data Source
AI summary
In one example, a semiconductor device includes a conductive structure having a conductive structure upper side. A roughening is on the conductive structure upper side and a groove is in the conductive structure extending partially into the conductive structure from the conductive structure upper side. An electronic component is attached to the conductive structure upper side with an attachment film. An encapsulant covers the electronic component, at least portions of the roughening, and at least portions of the conductive structure upper side. The groove has smoothed sidewalls that include substantially planarized portions of the roughening. The smooth sidewalls reduce flow of the attachment film across the conductive structure upper side to improve adhesion of the encapsulant to the conductive structure. Other examples and related methods are also disclosed herein.