Semiconductor Conductor Grooves for Solder Overflow Control
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Solution Overview
Problem
Existing semiconductor devices face issues with solder overflow during manufacturing, leading to potential peeling of the sealing material and reduced reliability due to inadequate design of conductor surfaces and bonding materials.
Innovation Solution
The semiconductor device incorporates collector protrusions and grooves on the conductor surface, with specific dimensions and volumes designed to manage solder flow, preventing excess spread and ensuring secure bonding with the sealing material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the conductor surface is made flat and simple, then the manufacturing process is easy, but solder overflow occurs during manufacturing
Solution Approach 1:
The conductor surface is designed with local variations in height (protrusions and grooves) rather than being uniformly flat. These localized structural differences create specific regions that guide solder flow and containment, solving the solder overflow problem while maintaining overall manufacturing simplicity
Solution Approach 2:
The conductor surface is segmented into multiple functional regions: protrusions that provide solder placement zones and grooves that act as containment barriers. This segmentation allows precise control over solder behavior during manufacturing without complicating the overall fabrication process
2Reliability
If the bonding material is applied generously to ensure coverage, then bonding area is improved, but solder overflow increases and sealing material peeling occurs
Solution Approach 1:
The grooves create localized regions with different properties (depth and volume) that specifically address solder containment. These localized structural features prevent solder overflow without requiring reduction in overall bonding material coverage, thus maintaining bonding strength while eliminating harmful overflow effects
Solution Approach 2:
The groove structure converts the potential harm of excess solder into a benefit by providing designated containment zones. The solder that would otherwise overflow and cause peeling is redirected into the grooves, where it serves to fill voids and enhance bonding rather than create defects
3Volume of stationary object
If the groove volume is small, then the device size is reduced, but solder overflow cannot be effectively suppressed
Solution Approach 1:
The groove volume is designed to be sufficient only in the critical regions where solder overflow occurs, rather than uniformly throughout the entire conductor. This partial application of groove structures achieves effective solder containment with minimal additional volume, balancing device size and reliability requirements
Data Source
AI summary
According to one embodiment, a semiconductor device includes a pellet; a first conductor and a second conductor sandwiching the pellet in a first direction; a first bonding material bonding the pellet and the first conductor; and a second bonding material bonding the pellet and the second conductor; wherein a first surface of the first conductor that faces the pellet includes a plurality of protrusions overlapping the pellet and a groove surrounding the pellet, when seen in the first direction, a design value of a height of the protrusions is a first value, and a volume of the groove is based on a volume of a part between the pellet and the first conductor, with a first height between the pellet and the first conductor having a second value larger than the first value.