Semiconductor Module Ground Layout for Short-Circuit Noise Suppression
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Solution Overview
Problem
Conventional Intelligent Power Modules (IPMs) experience increased costs due to the need for external resistors to counter noise from short-circuit currents, which add complexity and expense.
Innovation Solution
Incorporating an impedance component within the semiconductor module package to electrically connect the power ground terminal to the control ground terminal through a current detection resistor and impedance component, eliminating the need for external resistors and reducing module footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an external resistor is used to counter noise from short-circuit currents, then noise protection is improved, but device complexity and cost increase
Solution Approach 1:
The patent combines the noise countermeasure function with the existing current detection resistor by connecting it to the control ground terminal, integrating multiple functions into a single component rather than adding a separate external resistor
Solution Approach 2:
The current detection resistor is given dual functionality: it serves both as the current detection element and as the noise countermeasure component by providing the necessary impedance connection to the control ground terminal
2Reliability
If an external resistor is used to counter noise, then noise protection is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges the noise countermeasure function with the existing current detection resistor, eliminating the need for a separate external resistor component and reducing overall manufacturing cost
Solution Approach 2:
The current detection resistor serves its primary current detection function while simultaneously providing the noise countermeasure function, making the system self-sufficient without requiring additional components
3Device complexity
If impedance component is integrated inside the package, then device complexity is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent integrates the impedance function into the existing current detection resistor connection within the package, combining multiple functions into established structural elements rather than adding separate components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively mitigates noise from short-circuit currents without increasing costs, by integrating impedance components within the module, thus preventing the need for external resistors and reducing module size.
Implementation Method 1
each of the first and second control devices includes a control ground connected to a control ground terminal on the side surface of the first long side, the main power terminal and the power ground terminal are disposed on the side surface of the second long side, and the power ground terminal is connected to a current detection resistor disposed outside the package, and is electrically connected inside the package to the control ground terminal through the current detection resistor and an impedance component disposed inside the package
Data Source
AI summary
A semiconductor module includes first and second switching devices and first and second control devices all sealed in a package rectangular in a plan view, signal terminals on a side surface of a first long side input signals to the first and second control devices, each of the first and second switching devices outputs one of the signals from an output terminal on a side surface of a second long side, each of the first and second control devices includes a control ground connected to a control ground terminal on the side surface of the first long side, a main power terminal and a power ground terminal are disposed on the side surface of the second long side, and the power ground terminal is electrically connected inside the package to the control ground terminal through a current detection resistor outside the package and an impedance component inside the package.