Semiconductor Package Ground Studs for Footprint Reduction
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Solution Overview
Problem
Current semiconductor packages with backside grounding face challenges in reducing package size while maintaining effective electrical connectivity and supporting larger dies without increasing footprint.
Innovation Solution
The semiconductor package design includes a die coupled to an electrically insulative layer, with ground studs extending through the layer to physically couple the lead frame and die, allowing for reduced footprint and support of larger dies by using ground studs to establish electrical connectivity directly between the lead frame and die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If a die attach pad is used to connect the die to the lead frame, then electrical connectivity is established, but the package size increases and the die area is reduced
Solution Approach 1:
The patent transitions from planar die attach pads to three-dimensional ground studs that extend vertically through the insulative layer. This dimensional change allows electrical connectivity to be established in the vertical dimension rather than requiring additional horizontal space, thereby reducing package footprint while maintaining die area
Solution Approach 2:
The patent introduces ground studs as intermediary elements that penetrate the insulative layer to establish electrical connection between the lead frame and die. These studs act as mediators that provide electrical connectivity without requiring direct die-to-lead-frame contact, eliminating the need for large die attach pads
2Area of stationary object
If the package size is reduced, then footprint is minimized, but electrical connectivity and grounding effectiveness may be compromised
Solution Approach 1:
By moving electrical connectivity to the vertical dimension through ground studs that extend through the insulative layer, the patent achieves effective electrical connection without increasing horizontal footprint. The ground studs create direct vertical pathways for electrical signal and ground connection
Solution Approach 2:
The ground studs serve multiple functions simultaneously: they provide electrical connectivity, establish ground reference, and maintain mechanical alignment between die and lead frame. This multi-functionality ensures reliable electrical connection while minimizing package size
3Reliability
If wire bonds are used to connect the die to the lead frame, then electrical connectivity is achieved, but additional space and complexity are required
Solution Approach 1:
The patent merges the ground connection function with the structural support function by integrating ground studs directly into the lead frame structure. These studs combine grounding, mechanical support, and alignment functions into a single integrated component, reducing overall package complexity
Solution Approach 2:
The patent extracts the ground connection function from the wire bond system and implements it through separate ground studs. This separation allows the wire bonds to focus on signal transmission while ground studs handle grounding and mechanical support, simplifying the overall design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the semiconductor package size while enabling the use of larger dies by providing a direct ground connection through ground studs, enhancing electrical coupling and reducing the overall footprint of the package.
Implementation Method 1
at least one ground stud physically coupled to the lead frame and to the die, the at least one ground stud extending from the second side of the electrically insulative layer into the electrically insulative layer from the lead frame
Implementation Method 2
The die may be wire bonded to the lead frame
Data Source
AI summary
Implementations of a semiconductor package may include a first side of a die coupled to a first side of an electrically insulative layer, a second side of the electrically insulative layer coupled to a lead frame, and at least one ground stud physically coupled to the lead frame and to the die, the at least one ground stud extending from the second side of the electrically insulative layer into the electrically insulative layer from the lead frame. The die may be wire bonded to the lead frame.