Semiconductor Device Peripheral Ground Terminal Coupling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The reliability of coupling between a package including a PA module and a mounting board is compromised due to differences in solder thickness and area between terminals coupled by a conductor pattern and independently arranged terminals, leading to potential poor contact and instability in the reference potential supply.
Innovation Solution
A semiconductor device with a wiring board featuring a central ground terminal and peripheral ground terminals, where the peripheral terminals are electrically coupled by a conductor pattern with a width smaller than the terminals, improving the stability and reliability of the reference potential supply.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If peripheral ground terminals are electrically coupled by a conductor pattern, then the stability of reference potential is improved, but the solder thickness and area uniformity deteriorates
Solution Approach 1:
The conductor pattern is designed with a width smaller than the terminal width, creating a localized coupling structure. This local quality approach allows the conductor pattern to provide electrical coupling between peripheral ground terminals for stabilizing reference potential, while minimizing its impact on solder distribution. The selective narrowing of the conductor pattern in specific regions enables both functions to coexist.
Solution Approach 2:
The conductor pattern is segmented into multiple sections rather than forming a continuous wide structure. This segmentation allows different portions of the terminal structure to maintain their independence where needed (for uniform soldering) while providing coupling where required (for reference potential stability). The segmented approach resolves the contradiction by distributing the coupling function across multiple localized points.
2Reliability
If the conductor pattern width is reduced, then the electrical coupling effectiveness is improved, but the structural strength and connectivity deteriorate
Solution Approach 1:
The width parameter of the conductor pattern is optimized to a specific range that is smaller than the terminal width but not excessively narrow. This parameter change balances the competing requirements: narrow enough to maintain solder uniformity and electrical coupling effectiveness, yet wide enough to provide sufficient structural connectivity and mechanical strength. The specific width parameter serves as a compromise that satisfies both reliability and strength requirements.
Data Source
AI summary
To provide a technique that can improve the reliability of coupling between a package with a PA module and a mounting board in mounting the package over the mounting board. The width of a back conductor pattern is made smaller than the width of each of back terminals. Specifically, for example, the back terminals are arranged in the X direction. The back terminals arranged in parallel to the X direction are coupled together by the back conductor pattern. At this time, the coupling direction (coupling line direction) of the back conductor pattern is the X direction. Taking into consideration the Y direction orthogonal to (intersecting) the X direction, the width of the back conductor pattern in the Y direction is made smaller than the width of each of the back terminals in the Y direction.