Semiconductor Chip Ground Wire Shielding Harmonic Leakage
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Solution Overview
Problem
In recent power amplifier modules, harmonic components from one amplification path can leak into another, causing interference and degrading power amplification characteristics and receive sensitivity, especially when the frequency bands of second-order waves and fundamental waves overlap.
Innovation Solution
A semiconductor apparatus is designed with a substrate and semiconductor chip that includes first and second amplifiers, a harmonic termination circuit, and a ground wire. The harmonic termination circuit attenuates harmonic components, and a conductive portion or ground wire is strategically placed between amplification paths to reduce leakage, using frequency characteristics that match the resonant frequency of harmonic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple amplification paths are disposed on the same chip to reduce chip area, then chip area is reduced, but signal interference between amplification paths increases
Solution Approach 1:
A ground wire is introduced as an intermediary element disposed between the first amplification path and the second amplification path. This ground wire acts as a shield to block harmonic components from leaking from one amplification path to another, thereby reducing signal interference while maintaining the compact multi-path configuration on the same chip
2Object-generated harmful factors
If harmonic termination circuit is used to attenuate harmonic components, then harmonic attenuation is improved, but signal leakage into other amplification paths increases
Solution Approach 1:
The ground wire serves as a mediator that intercepts and redirects harmonic components generated by the harmonic termination circuit. By providing a dedicated ground path, the ground wire prevents these harmonic components from coupling into adjacent amplification paths, thus eliminating signal leakage while preserving the harmonic attenuation function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces signal interference between amplification paths, minimizing the degradation of power amplification characteristics and receive sensitivity by attenuating harmonic components and shielding the paths from each other.
Implementation Method 1
The ground wire is disposed between the first wire and the second output wire in a plan view of (viewed in a direction perpendicular to) a main surface of the semiconductor chip, and electrically connects the ground terminal of the semiconductor chip and the ground portion of the substrate
Implementation Method 2
The first harmonic termination circuit has frequency characteristics in which harmonic components contained in the first amplified signal are attenuated
Data Source
AI summary
A semiconductor apparatus includes the following elements. A substrate includes a ground portion to which a ground potential is supplied. A semiconductor chip is mounted on the substrate and includes first and second output terminals, a first terminator, and a ground terminal. First and second amplifiers are respectively formed in first and second regions of the semiconductor chip and respectively amplify first and second input signals of first and second frequency bands and output first and second amplified signals from the first and second output terminals via first and second output wires. A first harmonic termination circuit includes a first wire which electrically connects the first terminator and the ground portion. A ground wire is disposed between the first wire and the second output wire in a plan view of a main surface of the semiconductor chip and electrically connects the ground terminal and the ground portion.