Semiconductor Guard Ring Groove for Rear Chipping

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Solution Overview

Problem

The challenge in semiconductor chip manufacturing is the occurrence of chipping on the rear surface side during the dicing process, which can lead to defects and reduced packaging density, as existing technologies do not effectively address chipping issues related to through electrodes.

Innovation Solution

Incorporating a groove structure on the rear surface of the semiconductor substrate between the peripheral edge and through electrodes, which prevents chipping from intruding into the active area and improves yield during the dicing process, allowing for reduced chip size and increased packaging density.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If through electrodes are formed in the semiconductor chip to enable high-density packaging, then packaging density is improved, but chipping occurs on the rear surface side during dicing

Engineering Contradiction:

Improvepackaging densityVSAvoidchip integrity

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

A groove structure is formed on the rear surface of the semiconductor substrate before the dicing process. This groove acts as a pre-established barrier that prevents chipping from propagating into the active area during subsequent dicing operations, thereby protecting the through electrodes from damage while maintaining high packaging density

Inventive Principle:

Principle #10Preliminary action

2Manufacturing precision

If measures are taken to prevent front surface chipping, then front surface integrity is improved, but rear surface chipping is not addressed

Engineering Contradiction:

Improvefront surface integrityVSAvoidrear surface chipping

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

Instead of applying protective measures only on the front surface where chipping is traditionally addressed, the invention applies the groove structure on the rear surface of the semiconductor substrate. This inverted approach directly targets the source of rear surface chipping, preventing damage propagation from the back side while maintaining standard front surface protection methods

Inventive Principle:

Principle #13The other way round (Inversion)

3Productivity

If chip size is reduced to increase packaging density, then packaging density is improved, but chipping resistance is reduced

Engineering Contradiction:

Improvepackaging densityVSAvoidchipping resistance

Core Design Contradiction:

ProductivityVSStrength

Solution Approach 1:

The rear surface of the semiconductor substrate is segmented by forming a groove structure that divides the surface into distinct regions. This segmentation creates a physical barrier that stops chipping propagation, allowing smaller chip sizes to be used for high-density packaging without sacrificing chipping resistance, as the groove prevents damage from spreading across the entire chip

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS9117829B2Semiconductor device including guard ring and groove

Publication Date: 2015.08.25 LONGITUDE LICENSING LTD

AI summary

A semiconductor device includes a semiconductor substrate having a peripheral edge, a first surface, and a second surface opposite to the first surface, an inter-layer insulator including a guard ring formed on the first surface, adjacent to the peripheral edge of the semiconductor substrate, a first groove formed on the second surface, adjacent to the peripheral edge of the semiconductor substrate, and a through electrode penetrating the second surface to the inter-layer insulator near the groove and on an opposite side of the groove with respect to the peripheral edge.