Semiconductor Package Guide Pins for Pressfit Alignment
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Solution Overview
Problem
Existing semiconductor packages face challenges in accurately aligning pressfit pins with circuit board openings due to high offset tolerance values between guide pillars and pressfit pins, leading to insertion issues or pin damage.
Innovation Solution
The use of guide pins with a height greater than pressfit pins, arranged in specific configurations such as diagonally aligned pairs, and incorporating stress relief portions to facilitate precise alignment and prevent pin damage during insertion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If guide pillars are used to align pressfit pins, then alignment is provided, but high offset tolerance values lead to insertion issues or pin damage
Solution Approach 1:
The alignment function is segmented between guide pins (for positioning) and pressfit pins (for electrical connection). The guide pins are separated from the pressfit pins both functionally and physically, allowing each to perform its specialized function without interference. This segmentation resolves the contradiction by providing precise alignment through guide pins while preventing damage to pressfit pins during insertion.
Solution Approach 2:
Guide pins act as intermediary elements that facilitate the alignment process between the substrate and circuit board. These intermediaries perform the alignment function separately from the pressfit pins, allowing the pressfit pins to focus on electrical connection without bearing the mechanical alignment burden. This mediator approach eliminates the offset tolerance issues that directly affected pressfit pins in previous designs.
2Measurement precision
If guide pins are made taller than pressfit pins, then alignment precision is improved, but device complexity increases
Solution Approach 1:
The guide pins serve multiple functions: they provide alignment during insertion, act as mechanical support structures, and define the positioning interface between substrate and circuit board. By making these taller elements multi-functional, the design achieves precise alignment without adding separate dedicated alignment mechanisms, thereby avoiding increased device complexity.
Solution Approach 2:
The alignment function is merged into the guide pin structure itself, which also serves as a mechanical support and positioning element. Rather than adding separate alignment features, the guide pins combine multiple functions into a single structural element, achieving precise alignment while maintaining package simplicity.
3Manufacturing precision
If multiple guide pins are arranged in specific configurations, then alignment accuracy is improved, but manufacturing complexity increases
Solution Approach 1:
The guide pins are arranged in asymmetric configurations optimized for their specific alignment functions rather than symmetric patterns. This asymmetric arrangement allows precise alignment while simplifying the manufacturing process by reducing the number of pins needed compared to traditional symmetric multi-pin alignment systems. The asymmetric layout enables accurate positioning with fewer elements, improving both alignment accuracy and ease of manufacture.
Data Source
AI summary
A semiconductor guide pin is disclosed. Specific implementations may include a heatsink, one or more substrates coupled together, one or more pressfit pins coupled to the one or more substrates, and two or more guide pins coupled to the one or more substrates, where the two or more guide pins may have a height greater than the one or more pressfit pins.