Semiconductor Guide Member Prevents Terminal Abrasion
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Solution Overview
Problem
In existing semiconductor device mounting technologies, vibrations can cause abrasion between the contact pin of a connector and the guide hole, leading to degradation of connection reliability, especially in applications like vehicles where vibrations are significant.
Innovation Solution
A semiconductor device design featuring a guide member that guides electrode terminals into through holes or cut-outs in the substrate while being in contact during insertion and becomes out of contact afterward, preventing abrasion and ensuring reliable connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the guide member maintains continuous contact with the electrode terminal during insertion, then guiding accuracy is improved, but abrasion occurs leading to degraded connection reliability
Solution Approach 1:
The guide member transitions from a static continuous contact structure to a dynamic structure that changes its contact state during insertion. The guide member initially contacts the electrode terminal to provide guiding accuracy, then separates after insertion to eliminate abrasion. This dynamic state change resolves the contradiction between needing contact for accuracy and avoiding contact for reliability.
2Ease of operation
If the guide hole has a funnel shape with gradually increased diameter, then ease of insertion is improved, but the guide member remains in contact with the electrode terminal causing abrasion
Solution Approach 1:
The guide member is divided into functionally distinct regions: a funnel-shaped guiding portion that provides ease of insertion, and a separation mechanism that disconnects the guide member from the electrode terminal after insertion. This segmentation allows the funnel shape to remain for ease of insertion while adding a separation function to prevent abrasion and maintain reliability.
3Manufacturing precision
If the guide member continuously guides the electrode terminal, then positioning precision is improved, but insulation distance is reduced increasing abrasion risk
Solution Approach 1:
The guide member performs its guiding function as a preliminary action during the insertion process, providing positioning precision when needed. After the insertion is complete, the guide member separates from the electrode terminal, eliminating continuous contact and the associated abrasion risk. This preliminary action approach allows precision guiding without sustained harmful contact.
Data Source
AI summary
A semiconductor device includes a semiconductor module that has an electrode terminal projecting externally; a substrate that has a through hole or a cut-out for inserting the electrode terminal; and a guide member that is provided between the semiconductor module and the substrate and guides the electrode terminal in such a manner that the electrode terminal is inserted into the through hole or the cut-out. The guide member becomes out of contact with the electrode terminal after the electrode terminal is inserted into the through hole or the cut-out.