Semiconductor Device Alignment Using Guiding Plate and Multi-Axis Clamps
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Solution Overview
Problem
Existing methods for aligning semiconductor devices on carriers, such as the cavity and pin approaches, face challenges like poor alignment, tilting, and damage to surface components due to inadequate support and clearance issues, especially for densely populated Surface-Mount Technology (SMT) components.
Innovation Solution
An apparatus and method using a device support with protrusions to avoid contact with surface components and a clamping system with adjustable clamps to securely align and hold semiconductor devices along multiple axes, allowing for precise alignment and secure gripping without damaging surface components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If clearance is added between the BGA package and cavity to accommodate size variation, then adaptability improves, but alignment precision deteriorates
Solution Approach 1:
A guiding plate with a cavity serves as an intermediary structure between the BGA package and the processing system. The cavity is precisely positioned to guide the BGA package into correct alignment, while the guiding plate itself can accommodate size variations. This mediator structure enables both adaptability and precision simultaneously.
Solution Approach 2:
The guiding plate with pre-formed cavity openings is prepared in advance with precise positioning. The cavity openings are pre-aligned to match the BGA package footprint, so when the package is placed on the carrier, the alignment is already established before the actual processing begins. This preliminary preparation ensures both adaptability and precision.
2Manufacturing precision
If guiding interaction between cavity walls and BGA packages is increased to improve alignment, then alignment precision improves, but device stability deteriorates due to tilting
Solution Approach 1:
The guiding plate provides localized guidance only at the critical alignment points (cavity openings), while the rest of the BGA package surface remains free to be supported uniformly by the carrier. This localized guidance prevents tilting by providing support exactly where needed without creating uneven contact points that would cause instability.
Solution Approach 2:
The guiding function is segmented into discrete cavity openings that correspond to specific BGA package features, rather than relying on continuous wall contact. This segmentation allows precise alignment at key points while distributing support to maintain overall device stability.
3Manufacturing precision
If pins with minimal clearance are used to achieve precise alignment, then alignment precision improves, but ease of operation deteriorates requiring manual alignment
Solution Approach 1:
The guiding plate acts as a mediator that provides mechanical guidance through its cavity structure, eliminating the need for tight-tolerance pins. The cavity openings guide the BGA packages automatically through geometric constraint, providing both precision and ease of automated operation without requiring manual intervention.
4Force
If vacuum suction is applied to hold the semiconductor device, then gripping force improves, but device stability deteriorates due to damage to surface components
Solution Approach 1:
The vacuum suction function is extracted from direct contact with the device surface. Instead of applying vacuum to the front surface with components, the system uses the rear surface or edges for suction, removing the harmful contact from the component-rich areas while maintaining adequate gripping force through alternative contact points.
Data Source
AI summary
An apparatus is provided for arranging for processing a semiconductor device having surface components on its surface. A device support comprising a set of protrusions for contacting a surface of the semiconductor device supports the semiconductor device on a plane. The protrusions are arranged and positioned such that they avoid contact with the surface components on the surface. In order to grip the semiconductor device supported on the plane, a clamping device having a first set of clamps is configured for gripping the semiconductor device along a first axis and a second set of clamps is configured for gripping the semiconductor device along a second axis perpendicular to the first axis.