Semiconductor Test Handler with Split Pick-and-Place Thermal Modules
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Solution Overview
Problem
Existing semiconductor device handlers face challenges in efficiently handling devices of varying sizes, requiring recalibration and additional optical components, and suffer from inefficiencies in temperature-controlled testing due to heavy thermal components and large enclosures, leading to increased costs and energy waste.
Innovation Solution
A handler system with separate pick-and-place and thermal subsystems that are independently movable, featuring a single vision system for device identification and precise alignment, and a casing for contained heat transfer, allowing efficient handling of devices of various sizes without additional fixtures or adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional handlers use heavy thermal components and large enclosures for temperature-controlled testing, then temperature control capability is achieved, but device complexity and cost increase
Solution Approach 1:
The handler is divided into separate functional modules: a pick-and-place module for device handling and a thermal module for temperature control. This segmentation allows each module to be optimized independently, reducing overall system complexity while maintaining temperature control capability.
Solution Approach 2:
The pick-and-place module is designed to handle multiple device types and sizes using the same mechanical structure, making it universal. The thermal module provides temperature control that can be applied to various devices, reducing the need for specialized heavy components for each device type.
2Temperature
If traditional handlers use large enclosures for temperature-controlled testing, then temperature control capability is achieved, but energy consumption increases
Solution Approach 1:
By separating the thermal module from a large enclosure and integrating it with the pick-and-place module, the system controls temperature only where needed (at the device location) rather than heating/cooling a large enclosed space, significantly reducing energy consumption.
Solution Approach 2:
Temperature control is applied locally at the device location through the integrated thermal module rather than uniformly across a large enclosure. This localized approach reduces the volume requiring temperature control and minimizes energy consumption while maintaining effective temperature management.
3Manufacturing precision
If handlers are designed for specific device sizes, then handling precision is improved, but adaptability to different device sizes decreases
Solution Approach 1:
The pick-and-place module employs universal fixtures and adjustable positioning mechanisms that can accommodate multiple device sizes and types. The same module handles different devices by adjusting parameters rather than requiring dedicated fixtures, maintaining precision while improving adaptability.
Solution Approach 2:
The handler incorporates dynamically adjustable components such as variable positioning systems and adaptable fixtures that can be reconfigured for different device sizes. This dynamic adaptability allows the system to maintain handling precision across various device types without requiring fixed specialized configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables cost-effective, precise, and efficient handling of semiconductor devices across different sizes and temperatures, reducing recalibration time and energy consumption while maintaining accurate testing results.
Implementation Method 1
a single vision system for device identification and precise alignment
Implementation Method 2
a casing for contained heat transfer
Data Source
AI summary
A handler in a system for handling semiconductor devices for testing, the handler comprising a first plate, a second plate offset from the first plate, a first subsystem slidably coupled to the first plate, and a second subsystem slidably coupled to the second plate. The first subsystem comprises a pick-and-place (PNP) carriage to slide along the Y-axis. The PNP carriage comprises a PNP head to slide along the X-axis. The PNP head comprises a PNP nozzle head to slide along the Z-axis. The second subsystem comprises a thermo-mechanical (TM) carriage to slide along the X-axis and a TM head slidably coupled to the carriage to slide along the Z-axis. The PNP nozzle head includes a PNP nozzle to pick a semiconductor device from a tray and place it to a printed circuit board for testing. The TM head provides pressure on the semiconductor device and facilitates testing at different temperatures.