Semiconductor Handler Throughput Optimization via Dynamic Motion Control

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Solution Overview

Problem

Current semiconductor test equipment faces significant mechanical index time delays and inefficiencies due to physical and economic constraints, leading to reduced throughput and increased costs, particularly in semiconductor manufacturing environments.

Innovation Solution

The implementation of a system and method that optimizes semiconductor device handler throughput by identifying and adjusting operational parameters, such as velocity, acceleration, and jerk, using the Theory of Constraints (ToC) and digital PID controllers to synchronize and balance the operations of multiple manipulators, thereby minimizing mechanical stress and downtime.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If mechanical operation speeds are increased to reduce index time, then throughput is improved, but equipment costs and mechanical stress increase

Engineering Contradiction:
ImprovethroughputVSAvoidequipment costs
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The system dynamically adjusts operational parameters (velocity, acceleration, jerk) of manipulators based on real-time conditions and device characteristics. The handler operates at optimized speeds rather than maximum speeds, adapting motion profiles to specific test scenarios and device types, thereby reducing mechanical stress while maintaining high throughput.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes physical parameters of mechanical operations by optimizing velocity, acceleration, and jerk profiles for different operational stages. Digital PID controllers continuously adjust these parameters to achieve optimal balance between throughput and mechanical stress, reducing equipment costs while maintaining productivity.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If mechanical operation speeds are increased to reduce index time, then throughput is improved, but reliability decreases

Engineering Contradiction:
ImprovethroughputVSAvoidhandler reliability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The handler system dynamically adapts its operational characteristics based on device type, test requirements, and mechanical condition. By continuously adjusting motion profiles and operational speeds, the system maintains high throughput while preventing mechanical failures and ensuring reliable operation.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

Digital PID controllers provide continuous feedback control of manipulator operations, monitoring and adjusting velocity, acceleration, and jerk in real-time. This feedback mechanism prevents excessive mechanical stress that could lead to failures, thereby maintaining both high throughput and reliable operation.

Inventive Principle:
Principle #23Feedback

3Loss of time

If index time is reduced through faster mechanical operations, then throughput is improved, but mechanical stress increases

Engineering Contradiction:
Improveindex timeVSAvoidmechanical stress
Core Design Contradiction:
Loss of timeVSStress or pressure

Solution Approach 1:

The system optimizes mechanical stress by carefully controlling velocity, acceleration, and jerk parameters during index operations. Rather than simply increasing speeds, the system adjusts the temporal profile of motion parameters to reduce peak stresses while maintaining reduced index time, achieving both goals simultaneously.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The handler employs periodic, rhythmic motion patterns with optimized acceleration and deceleration phases. This periodic action allows for reduced index time while distributing mechanical stress over time rather than concentrating it, thereby reducing peak mechanical stress on components.

Inventive Principle:
Principle #19Periodic action

4Productivity

If mechanical operations are sped up to reduce index time, then throughput is improved, but manufacturing precision decreases

Engineering Contradiction:
ImprovethroughputVSAvoiddevice handling precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The system dynamically adjusts motion precision based on the specific handling requirements of different device types and operational stages. During critical precision operations, the system automatically reduces speeds and increases control resolution, while maintaining high throughput during less critical transfer operations.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent implements parameter changes in velocity, acceleration, and positioning accuracy based on operational context. Digital PID controllers adjust these parameters in real-time to maintain manufacturing precision during device handling while optimizing for throughput, achieving both objectives simultaneously.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS9818631B2Semiconductor device handler throughput optimization
Publication Date: 2017.11.14 CELERINT LLC
  • US9818631B2 patent drawing
  • US9818631B2 patent drawing
  • US9818631B2 patent drawing

AI summary

A method and system are provided for optimizing operational throughput for a semiconductor device handler having multiple stages. The method includes receiving semiconductor devices for testing at an input carrier buffer, and operating the handler in the testing of semiconductor devices. The method also includes recording operational throughput characteristics for each operational stage of the handler, and analyzing recorded operational throughput characteristics for each operational stage of the handler. Additionally, the method includes determining which operational stage of the handler has the most limiting constraint causing a lowest operational drumbeat, and adjusting operational parameters of the operational stage of the handler that has the lowest operational drumbeat to increase the operational drumbeat. The method further includes repeating the method until an operational state is achieved such that further adjustments to operational parameters result in a decrease in the operational throughput for the semiconductor device handler.