Semiconductor Handling System Robot-to-Robot Handoff
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Solution Overview
Problem
Semiconductor manufacturing systems face challenges in efficiently scheduling resources and maintaining high utilization of process modules due to complexity and varying processing times, leading to duplication of equipment and underutilization, especially when sharing common processing steps across different machines.
Innovation Solution
The development of various process modules with multiple entries and slot valves, along with robotic arms, allows for concurrent processing and handling of multiple wafers, enabling better load balancing and increased throughput by facilitating robot-to-robot handoffs and efficient wafer transfer within a vacuum environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If common processing steps are shared across separate machines, then equipment utilization improves, but machine-to-machine transfer time delays and contamination risks increase
Solution Approach 1:
The patent combines multiple processing chambers into a single integrated vacuum processing system with a shared vacuum environment. This allows wafers to be processed in different chambers without breaking vacuum, eliminating machine-to-machine transfers and their associated time delays and contamination risks while maintaining high equipment utilization through shared resources.
Solution Approach 2:
The patent introduces a robotic handler as an intermediary within the shared vacuum environment to transfer wafers between processing chambers. This robotic intermediary enables seamless wafer movement without breaking vacuum, resolving the contradiction by providing both high utilization (through shared chambers) and zero transfer time (through vacuum-compatible robotic handling).
2Adaptability or versatility
If separate machines are used for different processing steps, then processing flexibility improves, but system complexity and underutilization increase
Solution Approach 1:
The patent designs processing chambers with universal capabilities that can handle multiple wafer sizes and process types. The chambers are equipped with adjustable fixtures and versatile processing tools, allowing a single integrated system to perform the functions of multiple specialized machines, thereby reducing system complexity while maintaining processing flexibility.
Solution Approach 2:
The patent implements dynamically reconfigurable processing chambers where the configuration can be changed during operation. The robotic handler and chamber fixtures can be repositioned and reconfigured to accommodate different processing requirements, providing adaptability within a single integrated system without the complexity of multiple fixed-function machines.
Data Source
AI summary
A method is provided. The method includes disposing a plurality of robotic facilities to form a semiconductor handling system, controlling the semiconductor handling system with a controller to handoff a workpiece between neighboring robotic facilities, and providing a software interface for the controller, wherein the software interface permits a user to view alternate configurations of the handling system in order to optimize a characteristic of the handling system.