Semiconductor Device Header With Extended Conductor Pattern
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Solution Overview
Problem
Existing semiconductor device headers face challenges in achieving satisfactory signal transmission characteristics, particularly at high frequencies, due to difficulties in balancing manufacturing cost reduction with maintaining high-frequency performance.
Innovation Solution
A semiconductor device header design featuring a main body with a heat dissipation section and a wiring board inside a cavity, where the wiring board includes conductor patterns extending beyond the heat dissipation section, ensuring effective heat management and signal transmission by using materials with high thermal conductivity and appropriate thermal expansion coefficients, and employing sealers to form coaxial lines with adjustable characteristic impedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the header structure is simplified to reduce manufacturing cost, then manufacturing cost is reduced, but signal transmission characteristics at high frequencies deteriorate
Solution Approach 1:
The conductor pattern is designed to extend locally beyond the heat dissipation section only in necessary areas to improve high-frequency signal transmission, while maintaining simplified structure elsewhere. This localized enhancement allows cost reduction through overall simplification while preserving critical high-frequency performance in specific regions.
2Reliability
If the conductor pattern is extended beyond the heat dissipation section, then signal transmission at high frequencies is improved, but device complexity increases
Solution Approach 1:
The conductor pattern is merged with the heat dissipation section structure, where the conductor extends naturally from the heat dissipation section rather than being a separate component. This integration achieves improved high-frequency transmission without adding discrete parts or complex assembly steps.
3Temperature
If materials with high thermal conductivity are used for heat dissipation, then heat dissipation performance is improved, but manufacturing cost increases
Solution Approach 1:
The header employs composite material construction where the heat dissipation section uses high thermal conductivity materials strategically positioned for maximum thermal management benefit, while other portions use cost-effective materials. This composite approach optimizes heat dissipation performance while controlling overall manufacturing cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances signal transmission by reducing signal loss and improving frequency capabilities, while maintaining effective heat dissipation and electrical connectivity, thus achieving superior high-frequency signal transmission characteristics.
Implementation Method 1
heat dissipation section provided on the upper surface of the main body section
Implementation Method 2
second conductor pattern provided on the second principal surface, and bonded to an inner wall surface of the cavity and the heat dissipation section
Data Source
AI summary
A header for a semiconductor device, includes a main body section having an upper surface, and a cavity formed in the upper surface, a heat dissipation section provided on the upper surface of the main body section, and a wiring board provided inside the cavity. The wiring board includes a substrate having a first principal surface, and a second principal surface provided on an opposite side from the first principal surface, a first conductor pattern provided on the first principal surface, and having a mounting section on which a semiconductor element is mounted, and a second conductor pattern provided on the second principal surface, and bonded to an inner wall surface of the cavity and the heat dissipation section. A portion of the first conductor pattern extends beyond the heat dissipation section when viewed in a thickness direction of the wiring board.