Semiconductor Device Header for Uniform Coolant Distribution

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Solution Overview

Problem

The existing fin-and-cooler-integrated semiconductor devices face issues with uneven cooling, leading to non-uniform cooling of semiconductor elements due to direct collisions of cooling water with fins, which hampers efficient heat dissipation.

Innovation Solution

A semiconductor device design incorporating a heat-transfer base plate, a fin portion with projecting structures, a cooling member, and a header acting as a water storage chamber between the inlet and fin portion, allowing coolant to flow uniformly to the fin, thereby enhancing cooling performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If cooling water directly collides with the fin portion, then cooling efficiency is improved, but uniformity of cooling is deteriorated

Engineering Contradiction:

Improvecooling efficiencyVSAvoiduniformity of cooling

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

A flow guide member is introduced as an intermediary component between the cooling water inlet and the fin portion. This flow guide member directs and distributes the cooling water flow uniformly across multiple regions before it reaches the fins, thereby maintaining high cooling efficiency while achieving uniform cooling distribution across the semiconductor element.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The cooling water flow path is segmented into multiple regions by the flow guide member. Instead of allowing water to collide directly with the entire fin portion at once, the flow is divided and directed to different sections, ensuring uniform heat dissipation across all areas of the semiconductor element.

Inventive Principle:

Principle #1Segmentation

2Volume of moving object

If the semiconductor device is reduced in size, then miniaturization is achieved, but cooling performance is deteriorated

Engineering Contradiction:

Improvedevice sizeVSAvoidcooling performance

Core Design Contradiction:

Volume of moving objectVSProductivity

Solution Approach 1:

The flow guide member is nested within the existing cooling member structure, integrating the flow distribution function into the compact cooling system. This nested design allows uniform cooling to be achieved without increasing the overall device volume, maintaining miniaturization while improving cooling performance.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The flow guide member and cooling member are merged into an integrated cooling structure. By combining the flow distribution function with the heat dissipation structure, the device achieves effective cooling performance in a compact form factor without requiring separate components.

Inventive Principle:

Principle #5Merging (Combining)

3Productivity

If cooling water flow rate is increased, then heat dissipation is improved, but flow uniformity is deteriorated

Engineering Contradiction:

Improveheat dissipationVSAvoidflow uniformity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The flow guide member creates locally optimized flow paths for different regions of the cooling system. Each region receives appropriately distributed cooling water flow, ensuring that high flow rates for effective heat dissipation do not compromise flow uniformity across different areas of the semiconductor element.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The uniformized flow of coolant from the header to the fin portion results in improved cooling performance, achieving enhanced uniformity and stability of heat dissipation while reducing the size and weight of the semiconductor device.

Implementation Method 1

coolant flowing out from the header to the fin portion collides with the fin portion under a uniformized flow state... cooling performance can be enhanced

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 2

a heat-transfer base plate provided below the semiconductor element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10388589B2Semiconductor device, inverter device, and vehicle

Publication Date: 2019.08.20 MITSUBISHI ELECTRIC CORP

AI summary

The object is to provide a technology capable of enhancing a cooling performance of a semiconductor device. The semiconductor device includes a fin portion including a plurality of projecting portions that are connected to a lower surface of a heat-transfer base plate, a cooling member covering the fin portion and being connected to an inlet through which coolant to flow toward the fin portion flows in and an outlet through which coolant flowing from the fin portion flows out, and a header being a water storage chamber that is provided between the inlet and the fin portion and is partitioned from the fin portion so as to be capable of allowing coolant to flow through from the inlet to the fin portion.