Semiconductor Heat Conductor Layout to Protect Interconnects
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Solution Overview
Problem
Heat generated by components in semiconductor arrangements can negatively impact the performance of interconnect arrangements, leading to potential heat damage due to inadequate heat dissipation.
Innovation Solution
A semiconductor arrangement is designed with a heat conductor coupled to a heat sink via a thermally conductive bonding layer, where the heat conductor is positioned over a heat source and the interconnect arrangement is below the heat source, facilitating heat dissipation away from the interconnects and towards the heat sink, thereby reducing the risk of heat damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat generating components are integrated into semiconductor arrangements, then functionality and performance are improved, but heat damage to interconnect arrangements occurs due to inadequate heat dissipation
Solution Approach 1:
The patent segments the heat management function by introducing a dedicated heat conductor layer separate from the interconnect arrangement. This heat conductor is positioned between the heat generating component and the interconnects, dividing the thermal management task from the electrical interconnection function, thereby protecting interconnects from heat damage while maintaining functionality.
Solution Approach 2:
The patent introduces a heat conductor as an intermediary element between the heat source (component) and the interconnect arrangement. This intermediary captures and conducts heat away from the interconnects through a thermally conductive bonding layer to a heat sink, preventing direct heat exposure to the interconnect metal layers and VIAs.
2Object-affected harmful factors
If heat conductors and heat sinks are added to dissipate heat, then heat damage to interconnects is reduced, but device complexity increases
Solution Approach 1:
The heat conductor layer is designed to serve multiple functions: it acts as a thermal management component (conducting heat away), maintains electrical isolation, and provides structural support. The thermally conductive bonding layer simultaneously bonds the heat conductor to the component and provides a thermal pathway, reducing the need for separate components and simplifying the overall structure.
Solution Approach 2:
The patent merges the heat conduction function with the bonding function by using a thermally conductive bonding layer that serves both to attach the heat conductor to the component and to conduct heat. This consolidation reduces the number of separate layers and interfaces needed, thereby reducing device complexity while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces heat exposure to the interconnect arrangement, minimizing the risk of heat damage and enhancing the reliability of semiconductor components by efficiently conducting heat away from critical metal layers and VIAs.
Implementation Method 1
Heat from the heat source conducts in the direction of the heat sink by way of the heat conductor and the thermally conductive material
Data Source
AI summary
A semiconductor arrangement includes a heat source above an interconnect layer and below a heat conductor. The heat conductor is coupled to a heat sink by a thermally conductive bonding layer. Heat from the heat source is conducted through the heat conductor in a direction opposite the direction of the interconnect layer, through the thermally conductive bonding layer, and to a heat sink. The heat conductor includes an arrangement of dielectric layers, dummy metal layers, and dummy VIA layers.