Semiconductor Heat Conductor Layout for Interconnect Heat Protection
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Solution Overview
Problem
Semiconductor arrangements face heat-related performance issues due to heat-generating components, which can cause damage to interconnect arrangements lacking effective heat dissipation mechanisms.
Innovation Solution
A semiconductor arrangement is designed with a heat conductor coupled to a heat sink via a thermally conductive bonding layer, where the heat conductor directs heat away from the interconnect arrangement to the heat sink, reducing heat exposure and potential damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If heat-generating components are included in semiconductor arrangements, then functional performance is improved, but heat damage to interconnect arrangements occurs
Solution Approach 1:
The patent extracts the heat dissipation function from the interconnect arrangement by introducing a separate heat sink structure. The heat sink is coupled to the interconnect arrangement through a thermally conductive material, allowing heat to be removed from the interconnect region without modifying the interconnect structure itself, thereby preventing heat damage while maintaining power functionality.
Solution Approach 2:
The patent introduces a thermally conductive material as an intermediary between the heat-generating interconnect arrangement and the heat sink. This intermediary material facilitates efficient heat transfer from the interconnect region to the heat sink, enabling the heat sink to protect the interconnect arrangement from heat damage while maintaining functional performance.
2Object-affected harmful factors
If heat dissipation structures are added to semiconductor arrangements, then heat damage is reduced, but device complexity increases
Solution Approach 1:
The heat sink structure is designed to serve multiple functions: it acts as a thermal management component for heat dissipation, provides mechanical support for the semiconductor device, and can serve as an electrical ground reference. By combining multiple functions into a single structure, the patent reduces device complexity while maintaining effective heat damage protection.
Solution Approach 2:
The patent merges the heat dissipation function with existing structural elements of the semiconductor device. The heat sink is integrated with the substrate or carrier structure, combining thermal management with the mechanical support function already provided by these elements, thereby minimizing the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces heat exposure to the interconnect arrangement, minimizing the risk of heat damage and improving the performance and reliability of semiconductor devices by efficient heat dissipation.
Implementation Method 1
Heat from the heat source conducts in the direction of the heat sink by way of the heat conductor and the thermally conductive material
Implementation Method 2
a thermally conductive material of a bonding layer over the heat conductor
Implementation Method 3
a heat sink over the thermally conductive material of a bonding layer
Data Source
AI summary
A semiconductor arrangement includes a heat source above an interconnect layer and below a heat conductor. The heat conductor is coupled to a heat sink by a thermally conductive bonding layer. Heat from the heat source is conducted through the heat conductor in a direction opposite the direction of the interconnect layer, through the thermally conductive bonding layer, and to a heat sink. The heat conductor includes an arrangement of dielectric layers, dummy metal layers, and dummy VIA layers.