Semiconductor Heat Dissipating Plate for Thermal Management
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Solution Overview
Problem
Semiconductor packages face challenges in managing high temperatures due to increased power consumption and heat generation, leading to potential deterioration of gate insulating films and increased leak currents, which reduces the lifespan and reliability of the semiconductor chip, especially in high-temperature environments like those found in automobiles.
Innovation Solution
The semiconductor device incorporates a heat dissipating plate between the semiconductor chip and leads, with a die pad and adhesive having higher thermal conductivity than the sealing resin, and a design that allows for efficient heat dissipation through multiple paths, including direct conduction to the packaging substrate, to reduce thermal resistance and prevent overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the semiconductor chip operates in a high temperature environment, then the operation speed and power consumption increase, but the gate insulating film deteriorates and leak current increases, reducing lifetime and reliability
Solution Approach 1:
The patent introduces a heat dissipating plate as an intermediary component between the semiconductor chip and the packaging substrate. This plate serves as a thermal mediator that conducts heat away from the chip, allowing the chip to operate at high speeds while the heat dissipation system maintains reliability by preventing excessive temperature accumulation that would cause gate insulating film deterioration and increased leak current
2Use of energy by moving object
If the semiconductor chip operates in a high temperature environment, then the power consumption increases, but the heat generation causes temperature to rise, reducing lifetime
Solution Approach 1:
The heat dissipating plate acts as a thermal intermediary that enables the system to handle high power consumption. By providing a dedicated thermal conduction path through the plate to the packaging substrate, the system can sustain higher power levels without the temperature rise that would otherwise limit the operational lifetime of the semiconductor chip
3Temperature
If a heat dissipating plate is added to improve heat dissipation, then the thermal resistance decreases, but the device complexity increases
Solution Approach 1:
The patent merges the heat dissipating plate with the existing packaging substrate structure. The plate is integrated into the substrate rather than being a completely separate component, and the adhesive used to bond the chip to the plate serves dual purposes: mechanical attachment and thermal conduction. This merging approach reduces the overall device complexity while still achieving improved heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively improves heat dissipation characteristics, reducing thermal resistance and enhancing the reliability and lifespan of the semiconductor chip by efficiently managing heat generated within the package, even under high-temperature conditions.
Implementation Method 1
a die pad and adhesive having higher thermal conductivity than the sealing resin
Implementation Method 2
efficient heat dissipation through multiple paths, including direct conduction to the packaging substrate
Data Source
AI summary
A semiconductor device has a die pad, a heat dissipating plate in the form of a frame arranged between the die pad and leads so as to surround the die pad, members that connect the die pad and the inner edge of the heat dissipating plate, and a suspension lead linked to the outer extension of the heat dissipating plate. A semiconductor chip larger than the die pad is mounted over the die pad and the members. Top surfaces of the die pad and the members in opposition to the back surface of the chip are bonded to the back surface of the chip with silver paste. Heat is conducted from the back surface of the chip to the heat dissipating plate via the silver paste, the die pad, and the members, and dissipated to the outside of the semiconductor device via the leads.