Semiconductor Device Heat Dissipation Plate Bonding
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Solution Overview
Problem
Conventional semiconductor devices face challenges in size reduction and heat dissipation, with issues such as die pad tilting, wire cutting, and uneven heat dissipation due to the use of pins for bonding and the need for large distances between terminals to prevent dielectric breakdown.
Innovation Solution
A method involving a lead frame with die pads and semiconductor chips, where a sealing resin is formed to cover the chips and die pads, and a heat dissipation plate is attached using an adhesive layer after the resin is formed, allowing for reduced pin usage and improved positioning and heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If pins are used to bond die pads to heat dissipation plate, then bonding strength is improved, but device size increases and die pad tilting occurs
Solution Approach 1:
The patent removes pins from the bonding structure entirely, extracting the harmful element that caused device size increase and die pad tilting. Instead, a direct bonding method is employed where the die pad is bonded to the heat dissipation plate without mechanical fasteners, achieving both size reduction and elimination of tilting while maintaining bonding strength through optimized bonding processes and materials.
Solution Approach 2:
The patent replaces the mechanical pin-based bonding system with a direct bonding system that uses bonding materials and processes (such as soldering, eutectic bonding, or other metallurgical bonding methods). This substitution eliminates the need for mechanical fasteners and their associated spaces, achieving compact device size while maintaining strong bonding through material-level connections.
2Manufacturing precision
If multiple pins are used to prevent die pad tilting, then positioning precision is improved, but device complexity increases
Solution Approach 1:
The patent extracts multiple pins from the bonding structure, replacing them with a simplified direct bonding approach. This eliminates the complexity of positioning and installing multiple pins while achieving sufficient positioning precision through the bonding process itself and the structural design of the die pad and heat dissipation plate interface.
Solution Approach 2:
The bonding interface is designed to serve multiple functions simultaneously: it provides bonding strength, positioning precision, and thermal conduction. By integrating these functions into a single bonding structure rather than using separate pins for each function, the patent reduces device complexity while maintaining positioning precision.
3Reliability
If large distance is maintained between terminals, then dielectric breakdown is prevented, but device size increases
Solution Approach 1:
The patent changes the electrical parameters of the terminal structure by applying conductive coatings (such as gold or other low-resistance materials) to the terminal surfaces. This parameter change reduces electrical resistance and allows for smaller clearance distances between terminals while maintaining dielectric breakdown prevention, thereby reducing device size without sacrificing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables size reduction of semiconductor devices while enhancing heat dissipation performance and reliability by eliminating the need for pin-based bonding and optimizing the placement of heat dissipation components.
Implementation Method 1
attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via an adhesive layer
Implementation Method 2
a heat dissipation plate attached to the die pads, with the sealing resin having a recess that receives the heat dissipation plate
Data Source
AI summary
A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.