Semiconductor Heat Dissipation Structure for Flexible Wiring Boards
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Solution Overview
Problem
Semiconductor devices with flexible wiring boards face challenges in heat dissipation due to low heat capacity and mechanical strength, and existing heat dissipation structures either suffer from insufficient heat conduction or electrostatic discharge risks when attempting to connect heat dissipation conductive patterns with IC chips.
Innovation Solution
A heat dissipation structure featuring a conductive pattern with a lead line pattern connected to IC chip electrodes and a physically spaced heat dissipation pattern with an interdigitated shape, allowing for efficient heat release without direct electrical connection, thereby reducing heat resistance and mitigating electrostatic discharge risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation conductive pattern is directly connected to the IC chip electrode, then heat dissipation efficiency is improved, but the risk of electrostatic discharge damage increases
Solution Approach 1:
The patent introduces a lead line pattern as an intermediary element between the IC chip electrode and the heat dissipation conductive pattern. The lead line pattern serves as a mediator that enables thermal coupling while maintaining electrical isolation, thus allowing heat to be conducted away from the IC chip without creating a direct electrical connection that could conduct electrostatic discharge to the sensitive chip electrodes.
Solution Approach 2:
The conductive pattern is segmented into functionally distinct components: a lead line pattern for electrical connection and a heat dissipation conductive pattern for thermal management. This segmentation allows the electrical and thermal functions to be separated, enabling the heat dissipation pattern to be optimized for thermal conductivity while the lead line pattern handles electrical connectivity, thereby preventing ESD pathways.
2Reliability
If the heat dissipation conductive pattern is physically spaced from the IC chip, then electrostatic discharge risk is reduced, but heat conduction efficiency deteriorates
Solution Approach 1:
The lead line pattern acts as a thermal intermediary that bridges the gap between the IC chip and the heat dissipation conductive pattern. Although physically spaced from the chip to prevent electrical contact, the lead line pattern maintains close proximity and thermal coupling, enabling efficient heat conduction through the intervening space without requiring direct physical contact between the heat dissipation pattern and the chip.
3Volume of moving object
If the flexible wiring board is made thinner to reduce size, then device compactness is improved, but mechanical strength and heat capacity decrease
Solution Approach 1:
The patent employs a composite structure consisting of a flexible insulating film with conductor layers formed thereon. This composite construction allows the wiring board to maintain flexibility and thin profile while the conductor layers provide enhanced thermal pathways. The multi-layer composite structure optimizes the balance between thickness, mechanical strength, and heat capacity by distributing functions across different material layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This structure enhances heat dissipation efficiency by increasing the longitudinal length of the gap between the lead line and heat dissipation patterns, reducing temperature gradients near the IC chip, and minimizing the risk of damage from electrostatic discharge.
Implementation Method 1
a heat dissipation structure in a semiconductor device becomes increasingly important... The heat value of an IC chip such as a liquid crystal driver IC during operation is on the increase
Implementation Method 2
a heat dissipation conductive pattern that is physically isolated from a signal line pattern is formed on the surface of the flexible wiring board
Implementation Method 3
The heat dissipation electrode of the IC chip and the heat dissipation conductive pattern of the wiring board are connected through a conductor
Data Source
AI summary
A semiconductor device includes a wiring substrate including a first surface, a second surface opposite to the first surface, a first heat dissipation conductive pattern formed on the first surface, a second heat dissipation conductive pattern formed on the first surface, a first wiring formed on the first surface, and a second wiring formed on the first surface. The semiconductor device also includes a semiconductor chip disposed on the wiring substrate and including a third surface and a fourth surface opposite to the third surface. In plan view, the second wiring is adjacent to the first and second heat dissipation conductive patterns without intervening any wiring and any conductive pattern between the second wiring and the first and second heat dissipation conductive patterns.