Semiconductor Device Heat Dissipation Member
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing semiconductor devices face challenges in heat dissipation from main terminals, particularly as miniaturization and high current density requirements lead to increased heat generation, which limits thermal management and can raise the temperature of the entire module and connected apparatus.
Innovation Solution
Incorporating a heat dissipation member with higher thermal conductivity, such as a metal block or thermally conductive resin, placed between the metal base and the internal end of the main terminal, to enhance heat dissipation by facilitating the transfer of heat from the main terminal to the metal base, while maintaining insulation and allowing for wider spacing between metal components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple main terminals are placed in row to handle high current density, then the current carrying capacity is improved, but the width of metal components is constrained by insulation distance requirements, limiting heat dissipation capability
Solution Approach 1:
A heat dissipation member (metal block or thermally conductive resin) is introduced as an intermediary component between the main terminal and the metal base. This mediator facilitates heat transfer from the terminal to the base without requiring direct contact, allowing wider metal components for better heat dissipation while maintaining necessary insulation distances between terminals.
Solution Approach 2:
The thermal conductivity parameter of the material between the terminal and metal base is changed from the standard resin case material to a specialized heat dissipation member with higher thermal conductivity (metal block or thermally conductive resin). This parameter change enables more efficient heat transfer while maintaining the electrical insulation requirements.
2Volume of moving object
If miniaturization is pursued to reduce module size, then the compactness is improved, but heat generation from main terminals increases, making thermal management more difficult
Solution Approach 1:
Instead of uniformly minimizing the entire module, the invention applies local quality enhancement by placing high thermal conductivity material specifically at the heat-generating main terminal locations. This localized approach to heat dissipation allows miniaturization elsewhere in the module while effectively managing heat where it is most critical.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively improves heat dissipation from the main terminal, reducing the overall temperature of the semiconductor device and connected apparatus, and allows for more efficient thermal management without increasing manufacturing complexity or costs.
Implementation Method 1
a heat dissipation member which is placed, in contact with the metal base, between the metal base and the internal end of the main terminal, and has a higher thermal conductivity than that of the resin case
Data Source
AI summary
There is provided a semiconductor device provided with a metal base, a frame-shaped resin case adhered to the metal base, a semiconductor chip having a main electrode and being disposed inside the resin case, a main terminal having an internal end which is electrically connected to the main electrode of the semiconductor chip, integrally fixed to the resin case, and exposed inside the resin case and an external end exposed outside the resin case, a heat dissipation member which is placed, in contact with the metal base, between the metal base and the internal end of the main terminal, and has higher thermal conductivity than that of the resin case.