Semiconductor Heat Dissipation via Metallic Plate and Vent Channel
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Solution Overview
Problem
Semiconductor devices face inadequate cooling due to the low thermal conductivity of their encapsulating housings, which also limits the reduction in housing thickness required for better thermal dissipation, leading to manufacturing issues like voids and insulation breakdowns.
Innovation Solution
A semiconductor device design incorporating a metallic heat sink and a thinner housing with an interlayer material of high thermal conductivity, such as a thermally conductive silicone elastomer, to enhance heat dissipation while maintaining dielectric strength and avoiding voids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the housing thickness is reduced to improve heat dissipation, then thermal dissipation performance is improved, but manufacturing quality deteriorates due to voids and insulation breakdown
Solution Approach 1:
A vent channel is introduced as an intermediary structure that allows air to escape from the mold cavity during the molding process. This mediator enables the mold compound to completely fill the cavity even when the housing thickness is reduced, preventing void formation and maintaining manufacturing quality while allowing thinner housing for better heat dissipation.
Solution Approach 2:
The invention changes the molding process parameters by introducing a vent channel that modifies the flow dynamics of the mold compound. This parameter change allows the process to accommodate reduced housing thickness by controlling air evacuation, thereby preventing defects while enabling improved thermal dissipation through thinner housing.
2Temperature
If the housing thickness is reduced to improve thermal dissipation, then heat dissipation is improved, but the housing cannot adequately protect against moisture and contaminants
Solution Approach 1:
The vent channel serves as an intermediary that resolves the conflict between thin housing and adequate protection. By enabling complete filling of the mold cavity, it ensures that the reduced-thickness housing is still fully encapsulated with protective mold compound, maintaining protection against moisture and contaminants while achieving improved thermal dissipation.
3Temperature
If a heat sink is added to improve heat dissipation, then thermal dissipation is improved, but device complexity increases
Solution Approach 1:
The vent channel structure serves multiple functions: it enables air evacuation during molding, prevents void formation, and allows for reduced housing thickness. This multi-functional element improves heat dissipation by enabling thinner housing without requiring an additional separate heat sink component, thereby improving thermal performance while avoiding increased device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases thermal dissipation, allowing for higher current carrying capacity and reduced housing thickness without compromising insulation or introducing voids, thus improving the performance and reliability of semiconductor devices.
Implementation Method 1
heat generated by the semiconductor dies is transferred through leads 14 and housing 12... The thermal conductivity of epoxy housing 12 is much less than that of heat sink 13
Implementation Method 2
an interlayer material of high thermal conductivity, such as a thermally conductive silicone elastomer, to enhance heat dissipation
Implementation Method 3
Device 10, substrate 11, and heat sink 13 are cooled using a cooling technique such as natural or forced-air convection
Data Source
Figure 1A~1B
Figure 2~57
Figure 3~7
AI summary
A semiconductor device mountable to a substrate includes a semiconductor die and an electrically conductive lead frame having first and second end portions and a first attachment surface and a second attachment surface. The die electrically contacts the first end portion of the lead frame on the first attachment surface. An externally exposed housing encloses the semiconductor die and the first end portion of the lead frame, said housing including a metallic plate facing the second attachment surface of the lead frame.