Semiconductor Package Heat Dissipation Pillars for Vertical Thermal Paths
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Solution Overview
Problem
As semiconductor devices become more integrated and generate more heat due to increased performance and functionality, existing technologies lack efficient methods for heat dissipation, leading to thermal management challenges.
Innovation Solution
A semiconductor package design incorporating a heat dissipation pillar connected to a semiconductor chip, with a heat dissipation structure that includes a heat dissipation pad, via, and pillar, allowing for effective heat transfer and dissipation outside the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If semiconductor devices are integrated to increase performance and functionality, then device performance and functionality are improved, but heat generation increases causing thermal management challenges
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional package substrate by introducing a dedicated heat dissipation pillar structure that extends from the semiconductor chip through the package substrate to the external environment. This separate heat dissipation path removes thermal management from the integrated circuit function, allowing high-performance devices to operate without thermal interference.
Solution Approach 2:
The patent transitions from planar heat dissipation to three-dimensional heat dissipation by verticalizing the heat dissipation path. The heat dissipation pillar extends in the vertical direction from the chip through multiple layers to the package exterior, creating a thermal conduction path in the Z-dimension that complements the horizontal electrical interconnections.
2Temperature
If heat dissipation structures are added to semiconductor packages, then thermal management is improved, but device complexity increases
Solution Approach 1:
The heat dissipation pillar is designed to serve multiple functions: it acts as a thermal conduction path from the chip to the exterior, provides structural support between layers, and serves as an anchor for the heat dissipation structure. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity.
Solution Approach 2:
The patent merges the heat dissipation function with the package substrate structure by integrating the heat dissipation pillar directly into the substrate layers. The pillar is formed as part of the substrate fabrication process rather than as a separate added component, combining thermal management with the structural foundation of the package.
3Temperature
If heat dissipation pillars are integrated into the package substrate, then heat dissipation efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The heat dissipation pillar is formed during the substrate fabrication process before the semiconductor chip is mounted. The pillar structure is pre-positioned and integrated into the substrate layers, establishing the thermal conduction path in advance. This preliminary formation ensures precise alignment with the chip's heat dissipation pad during subsequent chip mounting operations.
Solution Approach 2:
The heat dissipation pillar is positioned asymmetrically relative to the electrical connection regions, located in a region that does not interfere with signal paths. This asymmetric placement allows the pillar to extend through the substrate without requiring precise alignment with electrical vias or traces, reducing manufacturing precision requirements while maintaining effective thermal conduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables efficient heat dissipation from the semiconductor package, reducing warpage during manufacturing and enhancing thermal management by forming a heat dissipation path between the chip and the external environment.
Implementation Method 1
a heat dissipation pillar disposed on the heat dissipation pad... forming a heat dissipation path between the chip and the external environment
Data Source
AI summary
A semiconductor package includes a lower redistribution structure, a first semiconductor chip and a second semiconductor chip that stacked on the lower redistribution structure, the second semiconductor chip including a heat dissipation pad disposed at an upper surface of the second semiconductor chip, a lower conductive pillar disposed on the lower redistribution structure, an upper conductive pillar disposed on the lower conductive pillar, a heat dissipation pillar disposed on the heat dissipation pad, an upper redistribution structure disposed on the upper conductive pillar; and a heat dissipation structure disposed on the heat dissipation pillar.