Semiconductor Device Heat Dissipation Plate Projections
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor devices require thick wiring substrates and heat dissipation plates for mechanical strength, which limits the reduction in device thickness and can lead to increased temperature and potential failure due to inadequate heat dissipation.
Innovation Solution
A semiconductor device design featuring a wiring substrate with a heat dissipation plate bonded using an adhesive, where the heat dissipation plate includes projections that project outward from the body, and an encapsulation resin fills the gaps, enhancing mechanical strength and heat dissipation while allowing for a thinner device structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the wiring substrate and heat dissipation plate are made thick to ensure mechanical strength, then the mechanical strength is improved, but the thickness of the entire semiconductor device cannot be reduced
Solution Approach 1:
The heat dissipation plate is segmented into a body portion and projection portions that extend downward. The projection portions are embedded in the encapsulation resin to provide mechanical anchoring, while the body portion maintains thermal contact with the semiconductor element. This segmentation allows the heat dissipation plate to provide mechanical strength through the projections without requiring excessive thickness.
Solution Approach 2:
The projection portions of the heat dissipation plate are nested within the encapsulation resin, creating a interlocked structure. The encapsulation resin surrounds and anchors the projections, providing mechanical strength to the overall assembly while allowing the heat dissipation plate itself to remain relatively thin.
2Strength
If conventional thick structures are used for mechanical strength, then structural stability is maintained, but heat dissipation efficiency is reduced due to increased thermal resistance
Solution Approach 1:
The heat dissipation plate is divided into a body portion for thermal conduction and projection portions for mechanical anchoring. This segmentation allows the body portion to remain thin and efficient for heat dissipation while the projections provide the necessary mechanical stability through embedding in the encapsulation resin.
Solution Approach 2:
The encapsulation resin acts as an intermediary that anchors the projection portions of the heat dissipation plate. This intermediary structure provides mechanical stability without interfering with the thermal conduction path from the semiconductor element through the heat dissipation plate body.
3Length of stationary object
If the heat dissipation plate is made thin to reduce device thickness, then the device thickness is reduced, but the mechanical strength and warping resistance are insufficient
Solution Approach 1:
The heat dissipation plate is segmented with projection portions extending downward from the body. These projections are embedded in the encapsulation resin to provide mechanical anchoring and warping resistance, allowing the body portion to remain thin for efficient heat dissipation and reduced overall device thickness.
Solution Approach 2:
The mechanical strength is not provided by increasing the thickness of the heat dissipation plate body, but by adding projection portions in the vertical dimension that extend into the encapsulation resin. This dimensional change provides mechanical anchoring without increasing the thermal conduction path length.
4Strength
If projections are added to the heat dissipation plate to enhance mechanical strength, then the mechanical strength is improved, but the device complexity increases
Solution Approach 1:
The heat dissipation plate is segmented into a body and projections, but this segmentation is achieved through a relatively simple geometric modification that can be integrated into conventional manufacturing processes. The projections are straightforward extensions that embed into the encapsulation resin, providing mechanical strength without significantly complicating the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces the thickness of the semiconductor device, improves heat dissipation, and enhances mechanical strength, preventing warping and oxidation issues while maintaining efficient heat transfer.
Implementation Method 1
A heat dissipation plate 50 is bonded to an upper surface of the semiconductor element 30 with an adhesive 40
Implementation Method 2
the heat is transmitted to the heat dissipation plate through the adhesive and then to the atmospheric air from the heat dissipation plate
Implementation Method 3
the heat is transmitted to the heat dissipation plate through the adhesive and then to the atmospheric air from the heat dissipation plate
Implementation Method 4
An encapsulation resin 60 fills a gap between the heat dissipation plate 50 and the wiring substrate 20
Data Source
AI summary
A semiconductor device includes a wiring substrate, a semiconductor element mounted on the wiring substrate, a heat dissipation plate bonded to an upper surface of the semiconductor element with an adhesive, and an encapsulation resin that fills a gap between the heat dissipation plate and the wiring substrate. The heat dissipation plate includes a body overlapped with the semiconductor element in a plan view. The body is larger than the semiconductor element in a plan view. A projection is formed integrally with the body. The projection projects outward from an end of the body and is located at a lower position than the body. The encapsulation resin covers upper, lower, and side surfaces of the projection. The body includes an upper surface exposed from the encapsulation resin.