Stacked Semiconductor Heat Dissipation via Substrate Segmentation
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Solution Overview
Problem
In semiconductor devices with a stacked chip configuration, particularly those with flip-chip mounted semiconductor chips on metal substrates, heat dissipation from the bottom semiconductor chip is inadequate, leading to thermal issues and potential component problems.
Innovation Solution
Implementing a heat absorption structure, such as a metal substrate, a heat conduction portion using connection metals, and a recess in the substrate to create an efficient heat escape route, which includes an adhesion portion and a strengthening convex portion to enhance heat dissipation and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flip-chip mounted semiconductor chip is placed on a metal substrate in a stacked configuration, then electrical connection and structural support are achieved, but heat dissipation from the bottom semiconductor chip becomes inadequate
Solution Approach 1:
The substrate is divided into a first substrate and a second substrate positioned at different heights, creating a stepped configuration. This segmentation allows the bottom semiconductor chip to have direct thermal contact with the first substrate while maintaining electrical connection through the metal substrate, thereby improving heat dissipation without compromising structural integrity
Solution Approach 2:
The invention introduces a vertical height difference between the first and second substrates, transitioning from a planar to a three-dimensional stepped structure. This dimensional change creates additional thermal pathways and allows heat to dissipate more effectively from the bottom semiconductor chip while maintaining the stacked configuration
2Temperature
If the substrate is raised to improve heat dissipation, then thermal management improves, but the bonding pad may detach due to increased stress
Solution Approach 1:
The convex portion is strategically positioned beneath the bonding pad area, providing localized mechanical support and stress distribution. This local reinforcement allows the substrate to be raised for improved heat dissipation while preventing bonding pad detachment through enhanced structural support at the critical location
Solution Approach 2:
The convex portion acts as a pre-positioned structural reinforcement that cushions and distributes the stress generated by raising the substrate. This beforehand cushioning prevents bonding pad detachment before it can occur, allowing the heat dissipation improvement to be realized without compromising bonding strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively dissipates heat generated by the bottom semiconductor chip, reducing thermal stress and improving the reliability of stacked chip configurations by providing a robust heat management system.
Implementation Method 1
a heat absorption portion that is formed between the first semiconductor chip and the first substrate
Implementation Method 2
a heat conduction portion formed between the heat absorption portion and the outer connection portion to dissipate heat generated by the first semiconductor chip
Data Source
AI summary
A semiconductor device with efficient heat dissipating structures is disclosed. The semiconductor device includes a first semiconductor chip that is flip-chip mounted on a first substrate, a heat absorption portion that is formed between the first semiconductor chip and the first substrate, an outer connection portion that connects the first semiconductor chip to an external device and a heat conduction portion formed between the heat absorption portion and the outer connection portion to dissipate heat generated by the first semiconductor chip.