Multi-layered Semiconductor Heat Distribution
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Solution Overview
Problem
Multi-layered semiconductor apparatuses face challenges with heat dissipation, leading to operational errors and thermal deformation due to uneven thermal distribution and high temperatures generated by logic ICs in three-dimensional layered configurations, which existing technologies struggle to manage effectively.
Innovation Solution
The solution involves arranging semiconductor chips with circuit regions in specific configurations to spread out heat generation, such as overlapping, misalignment, and separation of heat-generating regions, along with the use of a heat control circuit to manage thermal distribution, and incorporating heat-releasing components and cooling methods like cooling pipes and microdrains to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple memory IC layers are stacked to increase memory capacity, then the memory capacity increases, but the heat dissipation area decreases and heat accumulation occurs
Solution Approach 1:
The patent transitions from two-dimensional planar arrangement to three-dimensional stacked configuration, allowing memory ICs to be arranged in multiple layers vertically. This dimensional change increases memory capacity while distributing heat generation across different spatial levels, improving heat dissipation efficiency through the added vertical dimension.
Solution Approach 2:
The patent divides the heat dissipation function into multiple independent heat dissipation structures (heat dissipation fins, heat dissipation plates) distributed across different layers. Each layer has its own heat dissipation components, segmenting the thermal management system to prevent heat accumulation in any single region.
2Area of stationary object
If logic IC and memory IC are integrated in a single package to reduce area, then the installation area decreases, but thermal stress and operational errors increase due to poor heat release
Solution Approach 1:
The patent combines logic IC and memory IC into a single integrated package with unified thermal management structures. The heat dissipation fins and plates serve both logic and memory components simultaneously, achieving space efficiency while maintaining reliable thermal performance through coordinated heat dissipation design.
Solution Approach 2:
The patent introduces heat dissipation plates and thermal interface materials as intermediary elements between the logic IC and memory IC. These intermediaries facilitate efficient heat transfer from both components to the heat dissipation fins, preventing thermal stress and operational errors while maintaining compact integration.
3Volume of stationary object
If heat-generating circuit regions are positioned close together to reduce package size, then the package size decreases, but heat concentration increases causing thermal deformation
Solution Approach 1:
The patent implements localized heat dissipation structures (individual heat dissipation fins and plates) positioned adjacent to each heat-generating circuit region. Each heat-generating area has its own dedicated heat dissipation components, providing localized thermal management that prevents heat concentration and thermal deformation while maintaining compact overall package dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively restricts temperature increases and thermal distribution fluctuations, preventing operational errors and damage to semiconductor elements by efficiently dispersing heat and improving thermal management within the multi-layered semiconductor apparatus.
Implementation Method 1
controlling rotation of a heat release fan based on temperature information
Implementation Method 2
temperature information from a thermal sensor disposed near the semiconductor package
Data Source
AI summary
Provided is a multi-layered semiconductor apparatus with improved heat diffusion and improved heat release. The multi-layered semiconductor apparatus (100) includes a plurality of layered semiconductor chips (20-1, 20-2) that each include at least one circuit region, and the circuit regions are arranged such that heat generated by the circuit regions as a result of the circuit regions being driven is spread out. The multi-layered semiconductor apparatus (100) further comprises a heat releasing section (50) that releases the heat generated by the circuit regions, and the circuit regions are arranged such that there is less thermal resistance between the heat releasing section and circuit regions that generate a greater amount of heat per unit area.