Power Semiconductor Heat Exchanger Layout for Lower Pressure Loss
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Solution Overview
Problem
Existing heat exchange devices in power conversion systems experience increased pressure loss due to cooling water flowing at a right angle into the fins, which affects heat dissipation performance.
Innovation Solution
A heat exchange device with a fin formation region and a buffer region separated by a partition, where cooling water flows in a transverse direction, and the inlet and outlet are positioned at both ends in the longitudinal direction, connected via a flow path pit, reducing pressure loss and improving heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling water flows at a right angle into the fins, then heat exchange area is utilized, but pressure loss increases
Solution Approach 1:
The water channel is divided into a first water channel and a second water channel that are spatially separated and connected via communication holes. This segmentation allows the cooling water to flow through separate paths, reducing turbulence and pressure loss while still effectively cooling both upper and lower surfaces of the semiconductor element through the fin structures in each channel.
2Loss of energy
If cooling water flows parallel to longitudinal direction, then pressure loss is reduced, but heat dissipation performance deteriorates
Solution Approach 1:
The invention transitions from a single-directional cooling approach to a three-dimensional dual-channel configuration. The first water channel cools the upper surface while the second water channel cools the lower surface, utilizing spatial dimensionality to achieve comprehensive heat dissipation without requiring high-velocity flow that would increase pressure loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration reduces pressure loss and enhances heat dissipation performance by optimizing the flow path of cooling water, promoting efficient heat exchange.
Implementation Method 1
a heat exchange device that is formed in a substantially rectangular shape and that cools a power semiconductor element
Implementation Method 2
cooling water flows in a transverse direction of the heat exchange device
Data Source
AI summary
A heat exchange device that is formed in a substantially rectangular shape and that cools a power semiconductor element, and a power conversion device comprising the heat exchange device, the heat exchange device including: a fin formation region in which cooling water flows in a transverse direction; and a buffer region formed in a lamination direction and facing the fin formation region, a partition wall being interposed therebetween, wherein an inlet and an outlet for the cooling water are respectively formed at at least one of both ends in a longitudinal direction, a flow path pit connecting the fin formation region and the buffer region is formed at both ends in the transverse direction, and the buffer region has a partition that divides the cooling water flowing in from the inlet and the cooling water flowing toward the outlet, and the inlet and the outlet are respectively connected to the fin formation region via the flow path pit.